公开(公告)号：US20180036818A1

公开(公告)日：2018-02-08

申请号：US15549535

申请日：2016-02-10

Applicant: Alpha Assembly Solutions Inc.

Inventor： Steven Dane Prokopiak ,  Sanyogita Arora ,  Ranjit S. Pandher ,  Ellen S. Tormey ,  Bawa Singh

IPC: B23K1/00 ,  B23K3/04 ,  H01R4/04

CPC classification number: B23K1/0016 ,  B23K1/203 ,  B23K3/04 ,  B23K35/00 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/362 ,  B23K2101/36 ,  B23K2101/42 ,  C09J7/10 ,  C09J2201/28 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01R4/04

Abstract: A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape.