公开(公告)号：US20180020554A1

公开(公告)日：2018-01-18

申请号：US15716963

申请日：2017-09-27

Applicant: Alpha Assembly Solutions Inc.

Inventor： Paul Joseph Koep ,  Ellen S. Tormey ,  Girard Sidone

IPC: H05K3/34 ,  B23K35/02 ,  B23K1/20 ,  B23K35/26 ,  B23K1/00 ,  B23K101/42

CPC classification number: H05K3/34 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/42 ,  H05K3/3457 ,  H05K3/3484 ,  Y10T403/479

Abstract: A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.

公开(公告)号：US10465295B2

公开(公告)日：2019-11-05

申请号：US15312799

申请日：2015-05-19

Applicant: Alpha Assembly Solutions Inc

Inventor： Steven Prokopiak ,  Ellen S. Tormey ,  Oscar Khaselev ,  Michael T. Marczi ,  Bawa Singh

IPC: C23F1/16 ,  C23F1/02 ,  H01L21/3213 ,  H01L31/18 ,  H01L31/0224 ,  H01L31/0216 ,  H01L31/0236

Abstract: A jettable etchant composition includes 1 to 90 wt % active ingredient, and a remainder containing any combination of the following: 10 to 90 wt % solvent, 0 to 10 wt % reducing agents,

公开(公告)号：US20180036818A1

公开(公告)日：2018-02-08

申请号：US15549535

申请日：2016-02-10

Applicant: Alpha Assembly Solutions Inc.

Inventor： Steven Dane Prokopiak ,  Sanyogita Arora ,  Ranjit S. Pandher ,  Ellen S. Tormey ,  Bawa Singh

IPC: B23K1/00 ,  B23K3/04 ,  H01R4/04

CPC classification number: B23K1/0016 ,  B23K1/203 ,  B23K3/04 ,  B23K35/00 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/362 ,  B23K2101/36 ,  B23K2101/42 ,  C09J7/10 ,  C09J2201/28 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01R4/04

Abstract: A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape.

公开(公告)号：US09801285B2

公开(公告)日：2017-10-24

申请号：US14386601

申请日：2013-03-15

Applicant: Alpha Assembly Solutions Inc.

Inventor： Paul Joseph Koep ,  Ellen S. Tormey ,  Girard Sidone

IPC: B23K31/02 ,  H05K3/34 ,  B23K35/26 ,  B23K35/02 ,  B23K1/00 ,  B23K1/20 ,  B23K101/42

CPC classification number: H05K3/34 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/42 ,  H05K3/3457 ,  H05K3/3484 ,  Y10T403/479

Abstract: A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.