公开(公告)号：US20240253979A1

公开(公告)日：2024-08-01

申请号：US18632802

申请日：2024-04-11

Applicant: Analog Devices, Inc.

Inventor： Xin Zhang ,  Christopher Needham ,  Andrew Proudman ,  Nikolay Pokrovskiy ,  George M. Molnar, II ,  Laura Cornelia Popa

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00325 ,  B81B7/0048 ,  B81C1/00063 ,  B81B2203/01

Abstract: A stress-isolated microelectromechanical systems (MEMS) device and a method of manufacture of the stress-isolated MEMS device are provided. MEMS devices may be sensitive to stress and may provide lower performance when subjected to stress. A stress-isolated MEMS device may be manufactured by etching a trench and/or a cavity in a first side of a substrate and subsequently forming a MEMS device on a surface of a platform opposite the first side of the substrate. Such a stress-isolated MEMS device may exhibit better performance than a MEMS device that is not stress-isolated. Moreover, manufacturing the MEMS device by first forming a trench and cavity on a backside of a wafer, before forming the MEMS device on a suspended platform, provides increased yield and allows for fabrication of smaller parts, in at least some embodiments.

公开(公告)号：US10759659B2

公开(公告)日：2020-09-01

申请号：US16160965

申请日：2018-10-15

Applicant: Analog Devices, Inc.

Inventor： Xin Zhang ,  Michael Judy ,  George M. Molnar ,  Christopher Needham ,  Kemiao Jia

IPC: B81B7/00

Abstract: A MEMS product includes a stress-isolated MEMS platform surrounded by a stress-relief gap and suspended from a substrate. The stress-relief gap provides a barrier against the transmission of mechanical stress from the substrate to the platform.

公开(公告)号：US20190047846A1

公开(公告)日：2019-02-14

申请号：US16160965

申请日：2018-10-15

Applicant: Analog Devices, Inc.

Inventor： Xin Zhang ,  Michael Judy ,  George M. Molnar ,  Christopher Needham ,  Kemiao Jia

IPC: B81B7/00

CPC classification number: B81B7/0048 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: A MEMS product includes a stress-isolated MEMS platform surrounded by a stress-relief gap and suspended from a substrate. The stress-relief gap provides a barrier against the transmission of mechanical stress from the substrate to the platform.

公开(公告)号：US11981560B2

公开(公告)日：2024-05-14

申请号：US17342442

申请日：2021-06-08

Applicant: Analog Devices, Inc.

Inventor： Xin Zhang ,  Christopher Needham ,  Andrew Proudman ,  Nikolay Pokrovskiy ,  George M. Molnar, II ,  Laura Cornelia Popa ,  Michael Judy

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00325 ,  B81B7/0048 ,  B81C1/00063 ,  B81B2203/01

Abstract: A stress-isolated microelectromechanical systems (MEMS) device and a method of manufacture of the stress-isolated MEMS device are provided. MEMS devices may be sensitive to stress and may provide lower performance when subjected to stress. A stress-isolated MEMS device may be manufactured by etching a trench and/or a cavity in a first side of a substrate and subsequently forming a MEMS device on a surface of a platform opposite the first side of the substrate. Such a stress-isolated MEMS device may exhibit better performance than a MEMS device that is not stress-isolated. Moreover, manufacturing the MEMS device by first forming a trench and cavity on a backside of a wafer, before forming the MEMS device on a suspended platform, provides increased yield and allows for fabrication of smaller parts, in at least some embodiments.

公开(公告)号：US20210380403A1

公开(公告)日：2021-12-09

申请号：US17342442

申请日：2021-06-08

Applicant: Analog Devices, Inc.

Inventor： Xin Zhang ,  Christopher Needham ,  Andrew Proudman ,  Nikolay Pokrovskiy ,  George M. Molnar, II ,  Laura Cornelia Popa ,  Michael Judy

IPC: B81B7/00 ,  B81C1/00

Abstract: A stress-isolated microelectromechanical systems (MEMS) device and a method of manufacture of the stress-isolated MEMS device are provided. MEMS devices may be sensitive to stress and may provide lower performance when subjected to stress. A stress-isolated MEMS device may be manufactured by etching a trench and/or a cavity in a first side of a substrate and subsequently forming a MEMS device on a surface of a platform opposite the first side of the substrate. Such a stress-isolated MEMS device may exhibit better performance than a MEMS device that is not stress-isolated. Moreover, manufacturing the MEMS device by first forming a trench and cavity on a backside of a wafer, before forming the MEMS device on a suspended platform, provides increased yield and allows for fabrication of smaller parts, in at least some embodiments.

公开(公告)号：US10167189B2

公开(公告)日：2019-01-01

申请号：US14502475

申请日：2014-09-30

Applicant: Analog Devices, Inc.

Inventor： Xin Zhang ,  Michael W. Judy ,  George M. Molnar ,  Christopher Needham ,  Kemiao Jia

IPC: H01L21/00 ,  B81B7/00

Abstract: A MEMS product includes a stress-isolated MEMS platform surrounded by a stress-relief gap and suspended from a substrate. The stress-relief gap provides a barrier against the transmission of mechanical stress from the substrate to the platform.