公开(公告)号：US10167189B2

公开(公告)日：2019-01-01

申请号：US14502475

申请日：2014-09-30

Applicant: Analog Devices, Inc.

Inventor： Xin Zhang ,  Michael W. Judy ,  George M. Molnar ,  Christopher Needham ,  Kemiao Jia

IPC: H01L21/00 ,  B81B7/00

Abstract: A MEMS product includes a stress-isolated MEMS platform surrounded by a stress-relief gap and suspended from a substrate. The stress-relief gap provides a barrier against the transmission of mechanical stress from the substrate to the platform.

公开(公告)号：US09410981B2

公开(公告)日：2016-08-09

申请号：US13910755

申请日：2013-06-05

Applicant: Analog Devices, Inc.

Inventor： Xin Zhang ,  Michael W. Judy

IPC: G01P15/125 ,  B81B3/00 ,  G01P15/08

CPC classification number: G01P15/125 ,  B81B3/0086 ,  B81B3/0094 ,  B81B2201/0221 ,  B81B2201/0235 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/04 ,  G01P2015/0837

Abstract: An MEMS device has a dynamically variable reference capacitor that provides a reference to a sense capacitance. In some embodiments, a 3-axis accelerometer includes a proof mass suspended above a substrate from an anchor, and a cantilevered Z-axis reference capacitor arm suspended above the substrate from the same anchor. In some embodiments, the proof mass is suspended from a plurality of anchors, and each anchor also supports one or more cantilevered arms, the cantilevered arms forming a dynamically variable reference capacitance.

Abstract translation: MEMS器件具有动态可变参考电容器，其提供对感测电容的参考。 在一些实施例中，3轴加速度计包括悬挂在来自锚固件的基板上方的检验质量块，以及从相同锚点悬挂在基板上方的悬臂Z轴参考电容臂。 在一些实施例中，证明物质从多个锚固体悬挂，并且每个锚固件还支撑一个或多个悬臂，悬臂构成动态可变参考电容。

公开(公告)号：US10545167B2

公开(公告)日：2020-01-28

申请号：US14887973

申请日：2015-10-20

Applicant: Analog Devices, Inc.

Inventor： Xin Zhang ,  Michael W. Judy ,  Mehrnaz Motiee

IPC: G01P15/097 ,  G01P15/18

Abstract: Multiple-axis resonant accelerometers are based on detection of resonance frequency changes of one or more electrostatically-driven resonator masses due to electrostatic gap changes under acceleration. Specifically, one or more resonator masses are configured to resonate simultaneously in different directions associated with different axes of sensitivity (e.g., X, Y, and/or Z axes). The motion of each resonator mass is monitored through one or more electrostatically-coupled sense electrodes. An acceleration along a particular axis of sensitivity causes a small change in the electrostatic gap(s) between the corresponding resonator mass(es) and the sense electrode(s) associated with that axis of sensitivity, and this electrostatic gap change manifests as a small change in the resonance frequency of the resonator from which an accelerometer output signal can be produced.

公开(公告)号：US20170108529A1

公开(公告)日：2017-04-20

申请号：US14887973

申请日：2015-10-20

Applicant: Analog Devices, Inc.

Inventor： Xin Zhang ,  Michael W. Judy ,  Mehrnaz Motiee

IPC: G01P15/097

Abstract: Multiple-axis resonant accelerometers are based on detection of resonance frequency changes of one or more electrostatically-driven resonator masses due to electrostatic gap changes under acceleration. Specifically, one or more resonator masses are configured to resonate simultaneously in different directions associated with different axes of sensitivity (e.g., X, Y, and/or Z axes). The motion of each resonator mass is monitored through one or more electrostatically-coupled sense electrodes. An acceleration along a particular axis of sensitivity causes a small change in the electrostatic gap(s) between the corresponding resonator mass(es) and the sense electrode(s) associated with that axis of sensitivity, and this electrostatic gap change manifests as a small change in the resonance frequency of the resonator from which an accelerometer output signal can be produced.

公开(公告)号：US20160090297A1

公开(公告)日：2016-03-31

申请号：US14502475

申请日：2014-09-30

Applicant: Analog Devices, Inc.

Inventor： Xin Zhang ,  Michael W. Judy ,  George M. Molnar ,  Christopher R. Needham ,  Kemiao Jia

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0048

Abstract: A MEMS product includes a stress-isolated MEMS platform surrounded by a stress-relief gap and suspended from a substrate. The stress-relief gap provides a barrier against the transmission of mechanical stress from the substrate to the platform.

Abstract translation: MEMS产品包括由应力消除间隙围绕并从衬底悬挂的应力隔离MEMS平台。 应力消除间隙提供阻挡机械应力从基板传递到平台的障碍。

公开(公告)号：US20130023082A1

公开(公告)日：2013-01-24

申请号：US13623633

申请日：2012-09-20

Applicant: Analog Devices, Inc.

Inventor： John R. Martin ,  Timothy J. Frey ,  Christine H. Tsau ,  Michael W. Judy

IPC: H01L21/762 ,  H01L21/50

CPC classification number: H01L23/10 ,  B81C1/00269 ,  B81C2203/0118 ,  B81C2203/019 ,  H01L24/94 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A method of forming a MEMS device provides first and second wafers, where at least one of the first and second wafers has a two-dimensional array of MEMS devices. The method deposits a layer of first germanium onto the first wafer, and a layer of aluminum-germanium alloy onto the second wafer. To deposit the alloy, the method deposits a layer of aluminum onto the second wafer and then a layer of second germanium to the second wafer. Specifically, the layer of second germanium is deposited on the layer of aluminum. Next, the method brings the first wafer into contact with the second wafer so that the first germanium in the aluminum-germanium alloy contacts the second germanium. The wafers then are heated when the first and second germanium are in contact, and cooled to form a plurality of conductive hermetic seal rings about the plurality of the MEMS devices.

Abstract translation: 形成MEMS器件的方法提供第一和第二晶片，其中第一和第二晶片中的至少一个具有MEMS器件的二维阵列。 该方法将第一锗的一层沉积到第一晶片上，并将一层铝 - 锗合金沉积到第二晶片上。 为了沉积合金，该方法将一层铝沉积到第二晶片上，然后将第二锗层沉积到第二晶片。 具体地，第二锗层沉积在铝层上。 接下来，该方法使第一晶片与第二晶片接触，使得铝 - 锗合金中的第一锗与第二锗接触。 然后当第一和第二锗接触时，晶片被加热，并且被冷却以围绕多个MEMS器件形成多个导电密封环。

公开(公告)号：US20160131480A1

公开(公告)日：2016-05-12

申请号：US14534467

申请日：2014-11-06

Applicant: Analog Devices, Inc.

Inventor： Jeffrey A. Gregory ,  Michael W. Judy

IPC: G01C19/56

CPC classification number: G01C19/5776

Abstract: In certain exemplary embodiments of the present invention, rather than having two or more electrodes connected to separate bond pads for making electrical connections to separate electrical circuits to perform various electrode functions (e.g., a drive electrode for performing a drive function and a sense electrode for performing a sense function as in FIG. 1), a common electrode that can perform multiple electrode functions is electrically connected to a single bond pad, with the two electrical circuits connected to the single bond pad. The two electrical circuits are then time-multiplexed so that the electrode can be used for both electrode functions. Among other things, such an arrangement reduces the number of bond pads and therefore allows for reduction of the size of the MEMS die.

Abstract translation: 在本发明的某些示例性实施例中，不是具有连接到分离的接合焊盘的两个或更多个电极，用于进行到分离的电路的电连接以执行各种电极功能（例如，用于执行驱动功能的驱动电极和用于 执行如图1所示的感测功能），可以执行多个电极功能的公共电极电连接到单键焊盘，其中两个电路连接到单键焊盘。 然后对两个电路进行时间复用，使得电极可用于两种电极功能。 除此之外，这种布置减少了接合焊盘的数量，因此允许减小MEMS管芯的尺寸。

公开(公告)号：US09297825B2

公开(公告)日：2016-03-29

申请号：US13785624

申请日：2013-03-05

Applicant: Analog Devices, Inc.

Inventor： Xin Zhang ,  Howard R. Samuels ,  Michael W. Judy

IPC: G01P15/125 ,  G01P15/08

CPC classification number: G01P15/125 ,  G01P15/08 ,  G01P2015/0831 ,  G01P2015/0834

Abstract: A single-axis tilt-mode microelectromechanical accelerometer structure. The structure includes a substrate having a top surface defined by a first end and a second end. Coupled to the substrate is a first asymmetrically-shaped mass suspended above the substrate pivotable about a first pivot point on the substrate between the first end and the second end and a second asymmetrically-shaped mass suspended above the substrate pivotable about a second pivot point on the substrate between the first end and the second end. The structure also includes a first set of electrodes positioned on the substrate and below the first asymmetrically-shaped mass and a second set of electrodes positioned on the substrate and below the second asymmetrically-shaped mass.

Abstract translation: 单轴倾斜模式微机电加速度计结构。 该结构包括具有由第一端和第二端限定的顶表面的基底。 耦合到衬底的是第一不对称形状的质量块，悬挂在衬底上方，可在第一端和第二端之间围绕衬底上的第一枢转点枢转，并且悬挂在衬底上方的第二不对称形状的质量可围绕第二枢转点枢转 第一端和第二端之间的衬底。 该结构还包括位于衬底上并位于第一不对称形状的质量下方的第一组电极和位于衬底上并位于第二不对称形状的质量下方的第二组电极。

公开(公告)号：US20150355222A1

公开(公告)日：2015-12-10

申请号：US13910755

申请日：2013-06-05

Applicant: Analog Devices, Inc.

Inventor： Xin Zhang ,  Michael W. Judy

IPC: G01P15/125 ,  B81B3/00

CPC classification number: G01P15/125 ,  B81B3/0086 ,  B81B3/0094 ,  B81B2201/0221 ,  B81B2201/0235 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/04 ,  G01P2015/0837

Abstract: An MEMS device has a dynamically variable reference capacitor that provides a reference to a sense capacitance. In some embodiments, a 3-axis accelerometer includes a proof mass suspended above a substrate from an anchor, and a cantilevered Z-axis reference capacitor arm suspended above the substrate from the same anchor. In some embodiments, the proof mass is suspended from a plurality of anchors, and each anchor also supports one or more cantilevered arms, the cantilevered arms forming a dynamically variable reference capacitance.

Abstract translation: MEMS器件具有动态可变参考电容器，其提供对感测电容的参考。 在一些实施例中，3轴加速度计包括悬挂在来自锚固件的基板上方的检验质量块，以及从相同锚点悬挂在基板上方的悬臂Z轴参考电容臂。 在一些实施例中，证明物质从多个锚固体悬挂，并且每个锚固件还支撑一个或多个悬臂，悬臂构成动态可变参考电容。

公开(公告)号：US08956904B2

公开(公告)日：2015-02-17

申请号：US13623633

申请日：2012-09-20

Applicant: Analog Devices, Inc.

Inventor： John R. Martin ,  Timothy J. Frey ,  Christine H. Tsau ,  Michael W. Judy

IPC: H01L21/762 ,  H01L21/50 ,  H01L23/10 ,  B81C1/00 ,  H01L23/00

CPC classification number: H01L23/10 ,  B81C1/00269 ,  B81C2203/0118 ,  B81C2203/019 ,  H01L24/94 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A method of forming a MEMS device provides first and second wafers, where at least one of the first and second wafers has a two-dimensional array of MEMS devices. The method deposits a layer of first germanium onto the first wafer, and a layer of aluminum-germanium alloy onto the second wafer. To deposit the alloy, the method deposits a layer of aluminum onto the second wafer and then a layer of second germanium to the second wafer. Specifically, the layer of second germanium is deposited on the layer of aluminum. Next, the method brings the first wafer into contact with the second wafer so that the first germanium in the aluminum-germanium alloy contacts the second germanium. The wafers then are heated when the first and second germanium are in contact, and cooled to form a plurality of conductive hermetic seal rings about the plurality of the MEMS devices.

Abstract translation: 形成MEMS器件的方法提供第一和第二晶片，其中第一和第二晶片中的至少一个具有MEMS器件的二维阵列。 该方法将第一锗的一层沉积到第一晶片上，并将一层铝 - 锗合金沉积到第二晶片上。 为了沉积合金，该方法将一层铝沉积到第二晶片上，然后将第二锗层沉积到第二晶片。 具体地，第二锗层沉积在铝层上。 接下来，该方法使第一晶片与第二晶片接触，使得铝 - 锗合金中的第一锗与第二锗接触。 然后当第一和第二锗接触时，晶片被加热，并且被冷却以围绕多个MEMS器件形成多个导电密封环。