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公开(公告)号：US20150035387A1
公开(公告)日：2015-02-05
申请号：US13955866
申请日：2013-07-31
Applicant: Analog Devices Technology
Inventor： John G. Macnamara , Padraig L. Fitzgerald , Raymond C. Goggin , Bernard P. Stenson
CPC classification number: H01H59/0009 , B81B7/007 , B81B2201/014 , B81B2207/092 , B81C1/00341 , H01H2001/0052 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49109 , H01L2924/181 , Y10T307/937 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
Abstract: A MEMS switch device including: a substrate layer; an insulating layer formed over the substrate layer; and a MEMS switch module having a plurality of contacts formed on the surface of the insulating layer, wherein the insulating layer includes a number of conductive pathways formed within the insulating layer, the conductive pathways being configured to interconnect selected contacts of the MEMS switch module.
Abstract translation: 一种MEMS开关装置，包括：基板层; 形成在所述基板层上的绝缘层; 以及MEMS开关模块，其具有形成在所述绝缘层的表面上的多个触点，其中所述绝缘层包括形成在所述绝缘层内的多个导电路径，所述导电路径被配置为互连所述MEMS开关模块的选定触点。
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2.发明申请INSULATING LOW SIGNAL LOSS SUBSTRATE, INTEGRATED CIRCUITS INCLUDING A NON-SILICON SUBSTRATE AND METHODS OF MANUFACTURE OF INTEGRATED CIRCUITS 审中-公开绝缘低信号损耗基板，包含非硅基板的集成电路和集成电路的制造方法公开(公告)号：US20140240944A1
公开(公告)日：2014-08-28
申请号：US13776545
申请日：2013-02-25
Applicant: ANALOG DEVICES TECHNOLOGY
Inventor： Bernard P. Stenson , Michael Morrissey , Seamus A. Lynch
IPC: B81B7/00
CPC classification number: H01L28/00 , H01L27/016 , H01L28/10 , H01L28/20 , H01L28/60
Abstract: A microelectronic circuit having at least one component adjacent a carrier which is not a semiconductor or sapphire.
Abstract translation: 微电子电路具有与不是半导体或蓝宝石的载体相邻的至少一个分量。
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