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公开(公告)号：US20240023265A1
公开(公告)日：2024-01-18
申请号：US18219434
申请日：2023-07-07
Applicant: Apple Inc.
Inventor： David Pakula , Richard Hung Minh Dinh , Scott Myers , Tang Yew Tan
CPC classification number: H05K7/14 , H04M1/0202 , G06F1/1656 , G06F1/1637 , G06F1/1658 , G06F1/1626 , H05K5/03 , G02B7/02 , H05K5/0086 , Y10T156/10 , Y10T29/49002 , H04M1/0266 , H04N23/51
Abstract: Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.
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公开(公告)号：US11099609B2
公开(公告)日：2021-08-24
申请号：US16439163
申请日：2019-06-12
Applicant: Apple Inc.
Inventor： Scott Myers , Richard Heley , Matthew Theobald , Adam Stagnaro , Tang Tan , Richard Dinh , David Pakula
Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.
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公开(公告)号：US20190297741A1
公开(公告)日：2019-09-26
申请号：US16439103
申请日：2019-06-12
Applicant: Apple Inc.
Inventor： David Pakula , Richard Hung Minh Dinh , Scott Myers , Tang Yew Tan
Abstract: Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.
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公开(公告)号：US20180120904A1
公开(公告)日：2018-05-03
申请号：US15829372
申请日：2017-12-01
Applicant: Apple Inc.
Inventor： Scott Myers , Richard Heley , Mattew Theobald , Adam Stagnaro , Tang Tan , Richard Dinh , David Pakula
CPC classification number: G06F1/1656 , G06F1/1626 , G06F1/1658 , G06F1/1684 , G06F1/1698 , H01Q1/2258 , H01Q1/241 , H04M1/0249 , H04M1/026 , H04M1/0274 , H05K5/02 , H05K5/0208 , H05K5/03 , Y10T29/49002 , Y10T29/49169
Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.
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公开(公告)号：US11737229B2
公开(公告)日：2023-08-22
申请号：US17899410
申请日：2022-08-30
Applicant: Apple Inc.
Inventor： David Pakula , Richard Hung Minh Dinh , Scott Myers , Tang Yew Tan
IPC: G06F1/16 , H05K7/14 , H04M1/02 , H05K5/03 , G02B7/02 , H05K5/00 , H04N23/51 , G02B13/00 , B29L31/34
CPC classification number: H05K7/14 , G02B7/02 , G06F1/1626 , G06F1/1637 , G06F1/1656 , G06F1/1658 , H04M1/0202 , H05K5/0086 , H05K5/03 , B29L2031/3481 , G02B13/001 , H04M1/0266 , H04N23/51 , Y10T29/49002 , Y10T156/10
Abstract: Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.
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Patent Agency Ranking
公开(公告)号：US11723165B2
公开(公告)日：2023-08-08
申请号：US17325639
申请日：2021-05-20
Applicant: Apple Inc.
Inventor： David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
CPC classification number: H05K5/03 , A45C11/00 , A45F5/00 , G06F1/1626 , G06F1/1656 , G06F3/041 , H04M1/0249 , H04M1/0266 , H05K5/0017
Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
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公开(公告)号：US11669131B2
公开(公告)日：2023-06-06
申请号：US17525614
申请日：2021-11-12
Applicant: Apple Inc.
Inventor： Scott Myers , Matthew Theobald , Richard Heley , Adam Stagnaro , Richard Hung Minh Dinh , David Pakula , Tang Yew Tan
CPC classification number: G06F1/1656 , G06F1/1626 , G06F1/1658 , G06F1/1684 , G06F1/1698 , H01Q1/2258 , H01Q1/241 , H01Q1/42 , H04M1/026 , H04M1/0249 , H04M1/0274 , H05K5/02 , H05K5/0208 , H05K5/0247 , H05K5/03 , Y10T29/49002 , Y10T29/49169
Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.
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公开(公告)号：US20200379519A1
公开(公告)日：2020-12-03
申请号：US16994299
申请日：2020-08-14
Applicant: Apple Inc.
Inventor： Scott Myers , Matthew Theobald , Richard Heley , Adam Stagnaro , Richard Hung Minh Dinh , David Pakula , Tang Yew Tan
Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.
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公开(公告)号：US20200379202A9
公开(公告)日：2020-12-03
申请号：US14869774
申请日：2015-09-29
Applicant: Apple Inc.
Inventor： David Pakula , Richard Hung Minh Dinh , Tang Yew Tan
Abstract: Improved housings for electronic devices are disclosed. An electronic device housing can make use of at least one outer member (e.g., cover) that can be aligned, protected and/or secured with respect to other portions of the housing for the electronic device. In one embodiment, an electronic device housing can have one or more outer members (e.g., exposed major surfaces), such as front or back surfaces, that are formed of glass. Protective sides can be provided in some embodiments to protect the edges of the one or more glass surfaces so as to dissipate impact forces and thus reduce damage to the electronic device housing. The one or more glass surfaces can be part of outer member assemblies that can be secured to other portions of the electronic device housing. The electronic device can be portable and in some cases handheld.
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公开(公告)号：US10234906B2
公开(公告)日：2019-03-19
申请号：US15829372
申请日：2017-12-01
Applicant: Apple Inc.
Inventor： Scott Myers , Richard Heley , Matthew Theobald , Adam Stagnaro , Tang Tan , Richard Dinh , David Pakula
Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.
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