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1.发明授权Electronic device enclosures and heatsink structures with thermal management features 有权具有热管理功能的电子设备外壳和散热器结构公开(公告)号：US09095076B2
公开(公告)日：2015-07-28
申请号：US14271353
申请日：2014-05-06
Applicant: Apple Inc.
Inventor： Vinh Diep , Chiew-Siang Goh , Doug Heirich , Alexander Michael Kwan , Cesar Lozano Villarreal
CPC classification number: H05K7/20436 , H05K13/00 , Y10T29/49002
Abstract: An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.
Abstract translation: 电子设备可以具有其中安装电子部件的壳体。 电子部件可以安装到诸如印刷电路板的基板上。 散热器结构可以散发由电子部件产生的热量。 壳体可以具有通过气隙与散热器结构分离的壳体壁。 外壳壁可以具有整体的支撑结构。 每个支撑结构可以具有突出穿过散热器结构中的对应开口的向内突出的部分。 突出部分可以各自具有纵向轴线和位于纵向轴线的圆柱形空腔。 每个支撑结构可以具有从纵向轴线径向向外延伸的翅片。
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2.发明申请ELECTRONIC DEVICE ENCLOSURES AND HEATSINK STRUCTURES WITH THERMAL MANAGEMENT FEATURES 审中-公开具有热管理功能的电子器件封装和散热器结构公开(公告)号：US20140293545A1
公开(公告)日：2014-10-02
申请号：US14271353
申请日：2014-05-06
Applicant: Apple Inc.
Inventor： Vinh Diep , Chiew-Siang Goh , Doug Heirich , Alexander Michael Kwan , Cesar Lozano Villarreal
CPC classification number: H05K7/20436 , H05K13/00 , Y10T29/49002
Abstract: An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.
Abstract translation: 电子设备可以具有其中安装电子部件的壳体。 电子部件可以安装到诸如印刷电路板的基板上。 散热器结构可以散发由电子部件产生的热量。 壳体可以具有通过气隙与散热器结构分离的壳体壁。 外壳壁可以具有整体的支撑结构。 每个支撑结构可以具有突出穿过散热器结构中的对应开口的向内突出的部分。 突出部分可以各自具有纵向轴线和位于纵向轴线的圆柱形空腔。 每个支撑结构可以具有从纵向轴线径向向外延伸的翅片。
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