AXIAL LEAD CAPACITORS
    1.
    发明申请
    AXIAL LEAD CAPACITORS 审中-公开
    轴向电容器

    公开(公告)号:US20160055975A1

    公开(公告)日:2016-02-25

    申请号:US14830587

    申请日:2015-08-19

    Applicant: Apple Inc.

    Abstract: This application includes multiple embodiments related to capacitors. In some embodiments, capacitors are set forth as having terminal leads that extend in parallel and opposing axial directions. The embodiments discussed herein relate to a capacitor module including one or more anodized pellets for providing a charge storage within the capacitor module. The capacitor module can be configured as a surface mounted or non-surface mounted capacitor module. The capacitor module can include an array of anodized pellets arranged in multiple rows or columns of anodized pellets connected by conductive trace included in the capacitor module. In a non-surface mounted embodiment of the capacitor module, the capacitor module can include cathode and anode connections that are exclusively on the side surfaces of the capacitor module.

    Abstract translation: 该应用包括与电容器相关的多个实施例。 在一些实施例中,将电容器设置为具有平行且相对轴向延伸的端子引线。 本文讨论的实施例涉及一种电容器模块,其包括用于在电容器模块内提供电荷存储的一个或多个阳极氧化颗粒。 电容器模块可以被配置为表面安装或非表面安装的电容器模块。 电容器模块可以包括阳极氧化颗粒的阵列,其被布置成多行或多列阳极氧化的颗粒,所述阳极氧化颗粒通过包含在电容器模块中的导电迹线连接 在电容器模块的非表面安装的实施例中,电容器模块可以包括仅在电容器模块的侧表面上的阴极和阳极连接。

    Electronic device enclosures and heatsink structures with thermal management features
    2.
    发明授权
    Electronic device enclosures and heatsink structures with thermal management features 有权
    具有热管理功能的电子设备外壳和散热器结构

    公开(公告)号:US09095076B2

    公开(公告)日:2015-07-28

    申请号:US14271353

    申请日:2014-05-06

    Applicant: Apple Inc.

    CPC classification number: H05K7/20436 H05K13/00 Y10T29/49002

    Abstract: An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.

    Abstract translation: 电子设备可以具有其中安装电子部件的壳体。 电子部件可以安装到诸如印刷电路板的基板上。 散热器结构可以散发由电子部件产生的热量。 壳体可以具有通过气隙与散热器结构分离的壳体壁。 外壳壁可以具有整体的支撑结构。 每个支撑结构可以具有突出穿过散热器结构中的对应开口的向内突出的部分。 突出部分可以各自具有纵向轴线和位于纵向轴线的圆柱形空腔。 每个支撑结构可以具有从纵向轴线径向向外延伸的翅片。

    ELECTRONIC DEVICE ENCLOSURES AND HEATSINK STRUCTURES WITH THERMAL MANAGEMENT FEATURES
    3.
    发明申请
    ELECTRONIC DEVICE ENCLOSURES AND HEATSINK STRUCTURES WITH THERMAL MANAGEMENT FEATURES 审中-公开
    具有热管理功能的电子器件封装和散热器结构

    公开(公告)号:US20140293545A1

    公开(公告)日:2014-10-02

    申请号:US14271353

    申请日:2014-05-06

    Applicant: Apple Inc.

    CPC classification number: H05K7/20436 H05K13/00 Y10T29/49002

    Abstract: An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.

    Abstract translation: 电子设备可以具有其中安装电子部件的壳体。 电子部件可以安装到诸如印刷电路板的基板上。 散热器结构可以散发由电子部件产生的热量。 壳体可以具有通过气隙与散热器结构分离的壳体壁。 外壳壁可以具有整体的支撑结构。 每个支撑结构可以具有突出穿过散热器结构中的对应开口的向内突出的部分。 突出部分可以各自具有纵向轴线和位于纵向轴线的圆柱形空腔。 每个支撑结构可以具有从纵向轴线径向向外延伸的翅片。

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