公开(公告)号：US09013869B2

公开(公告)日：2015-04-21

申请号：US14145584

申请日：2013-12-31

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Gregory Tice

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/40 ,  H05K3/30 ,  H05K7/12 ,  H01L23/473 ,  H01L23/427

CPC classification number: G06F1/20 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H05K3/301 ,  H05K7/12 ,  H05K7/20 ,  H05K7/20254 ,  H05K2201/064 ,  H05K2201/10265 ,  H05K2201/10325 ,  H05K2201/10393 ,  H05K2201/10704 ,  H05K2203/0278 ,  Y10T29/49124 ,  Y10T29/49826 ,  Y10T29/53113 ,  H01L2924/00

Abstract: A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.

Abstract translation: 公开了一种适用于去除在紧凑的计算环境中工作的集成电路产生的多余热量的低轮廓散热系统。

公开(公告)号：US20140211415A1

公开(公告)日：2014-07-31

申请号：US14145584

申请日：2013-12-31

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Gregory Tice

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H05K3/301 ,  H05K7/12 ,  H05K7/20 ,  H05K7/20254 ,  H05K2201/064 ,  H05K2201/10265 ,  H05K2201/10325 ,  H05K2201/10393 ,  H05K2201/10704 ,  H05K2203/0278 ,  Y10T29/49124 ,  Y10T29/49826 ,  Y10T29/53113 ,  H01L2924/00

Abstract: A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.

Abstract translation: 公开了一种适用于去除在紧凑的计算环境中工作的集成电路产生的多余热量的低轮廓散热系统。