SPACE-EFFICIENT FLEX CABLE WITH IMPROVED SIGNAL INTEGRITY FOR A PORTABLE ELECTRONIC DEVICE

    公开(公告)号:US20190082529A1

    公开(公告)日:2019-03-14

    申请号:US16127071

    申请日:2018-09-10

    Applicant: Apple Inc.

    Abstract: This application relates to a flexible cable for a portable electronic device, where the portable electronic device includes operational components having connectors that are capable of being electrically coupled to the flexible cable. The flexible cable includes a dielectric substrate having a generally planar shape, an upper grounding plane, a lower grounding plane, and a first signal transmission line that is separated by the upper and lower grounding planes, where the dielectric substrate is capable of electromagnetically shielding the first signal transmission line.

    DISTRIBUTED AUXILIARY HUB FOR A PORTABLE ELECTRONIC DEVICE

    公开(公告)号:US20210072801A1

    公开(公告)日:2021-03-11

    申请号:US16818680

    申请日:2020-03-13

    Applicant: Apple Inc.

    Abstract: A distributed auxiliary hub for a portable electronic device is disclosed. The distributed auxiliary hub, located on a stacked circuit assembly, can distribute electrical signals to multiple different destinations. The distributed auxiliary hub is displaced and separate from a main logic board, and as a result, can provide supplemental functions. Although the distributed auxiliary hub is electrically coupled to the main logic board, the distributed auxiliary hub includes dedicated integrated circuits responsible for executing functions related to battery charging and powering of electronic components (e.g., haptic feedback module, speaker module, etc.). As a result, the distributed auxiliary hub, when executing these aforementioned functions, is not reliant upon the main logic board to transmit electrical current to the battery and/or electronic components. The distributed auxiliary hub, when electrically coupled to an external resource, is capable of directly transmitting electrical current to electronic components.

    CIRCUIT BOARD INTERPOSER
    5.
    发明申请

    公开(公告)号:US20190082535A1

    公开(公告)日:2019-03-14

    申请号:US15875886

    申请日:2018-01-19

    Applicant: Apple Inc.

    Abstract: An interposer for mechanically and electrically connecting two circuit boards is described. The interposer can be bent to enclose an area of a circuit board. The interposer can include a first layer external to the enclosed area. The first layer can be conductive and can serve as an EMI shield. The interposer can also include a second layer internal to the enclosed area. The second layer can be non-conductive but can carry multiple discrete pins that can electrically couple the first and second circuit boards and provide signal transmission pathways between the circuit boards. The interposer can be formed by folding a sheet of conductive material having different cutout regions that forms a comb pattern into multiple stacked layers. Then, the bent regions that connect the stacked layers can be removed so that the conductive bars in the comb patterns can be separated and isolated to form discrete pins.

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