公开(公告)号：US20190254185A1

公开(公告)日：2019-08-15

申请号：US16396456

申请日：2019-04-26

Applicant: Apple Inc.

Inventor： Tyler B. CATER ,  Benjamin J. POPE ,  Scott A. MYERS ,  Benjamin Shane BUSTLE ,  Tseng-Mau YANG ,  Adam J. BRINKMAN

IPC: H05K5/02 ,  H04B1/3827 ,  H04M1/02 ,  H01Q1/52 ,  H01Q1/24 ,  G06F1/16

CPC classification number: H05K5/0208 ,  B29C37/0085 ,  B29C45/14311 ,  B29C45/14467 ,  G06F1/1626 ,  H01Q1/24 ,  H01Q1/243 ,  H01Q1/521 ,  H04B1/3827 ,  H04M1/0202 ,  H04M1/0249 ,  H04M1/185 ,  H05K5/0217

Abstract: An electronic device having multiple housing components interlocked together by a molded material is disclosed. In order to provide interlocking surfaces for the molded material, the housing components can include various geometries designed to receive and retain the molded material such that the housing components are secured with one another. For example, a first housing part can undergo several material removal operations to form multiple ribs, each with through holes. When the molded material extends along the ribs and into the through holes, the molded material cures and interlocks with the first housing part. A second housing part can include several stepped indentions that receive the molded material. Also, a third housing part can include a dovetail indention to receive the molded material such that the first and second housing parts interlock with the third housing part. The indentions can provide retention in three dimensions to protect against decoupling.

公开(公告)号：US20160380663A1

公开(公告)日：2016-12-29

申请号：US15263259

申请日：2016-09-12

Applicant: Apple Inc.

Inventor： Ashutosh Y. SHUKLA ,  Tyler B. CATER ,  Sawyer I. COHEN ,  Edward S. HUO ,  David A. PAKULA ,  Benjamin Shane BUSTLE ,  Dhaval N. SHAH ,  Yaocheng ZHANG ,  Vivek KATIYAR

IPC: H04B1/3888 ,  H04M1/02

CPC classification number: H04B1/3888 ,  H01H13/06 ,  H01H2205/016 ,  H01H2207/032 ,  H01H2213/00 ,  H01H2213/002 ,  H01H2213/016 ,  H01H2223/002 ,  H04B2001/3894 ,  H04M1/0249 ,  H04M1/026 ,  H04M1/236

Abstract: This application relates to various button related embodiments for use with a portable electronic device. In some embodiments, a snap clip can be integrated with a button bracket to save space where two separate brackets would take up too much space in the portable electronic device. In other embodiments, a tactile switch can be waterproofed by welding a polymeric layer atop a tactile switch assembly. In this way water can be prevented from contacting moisture sensitive components of the tactile switch assembly. The weld joining the polymeric layer to the tactile switch can include at least one gap to trapped gas surrounding the tactile switch assembly to enter and exit during heat excursions caused by various operating and/or assembly operations.

公开(公告)号：US20180070465A1

公开(公告)日：2018-03-08

申请号：US15454826

申请日：2017-03-09

Applicant: Apple Inc.

Inventor： Tyler B. CATER ,  Benjamin J. POPE ,  Scott A. MYERS ,  Benjamin Shane BUSTLE ,  Tseng-Mau YANG ,  Adam J. BRINKMAN

IPC: H05K5/02 ,  H01Q1/24 ,  H04B1/3827

CPC classification number: H05K5/0208 ,  G06F1/1626 ,  H01Q1/24 ,  H01Q1/243 ,  H01Q1/521 ,  H04B1/3827 ,  H04M1/0202 ,  H05K5/0217

Abstract: An electronic device having multiple housing components interlocked together by a molded material is disclosed. In order to provide interlocking surfaces for the molded material, the housing components can include various geometries designed to receive and retain the molded material such that the housing components are secured with one another. For example, a first housing part can undergo several material removal operations to form multiple ribs, each with through holes. When the molded material extends along the ribs and into the through holes, the molded material cures and interlocks with the first housing part. A second housing part can include several stepped indentions that receive the molded material. Also, a third housing part can include a dovetail indention to receive the molded material such that the first and second housing parts interlock with the third housing part. The indentions can provide retention in three dimensions to protect against decoupling.

公开(公告)号：US20160276757A1

公开(公告)日：2016-09-22

申请号：US15074817

申请日：2016-03-18

Applicant: Apple Inc.

Inventor： James B. SMITH ,  Gregory N. STEPHENS ,  Boon W. SHIU ,  Shayan MALEK ,  Marwan RAMMAH ,  Scott A. MYERS ,  Ashutosh Y. SHUKLA ,  Eric N. NYLAND ,  Matthew D. HILL ,  Michael Benjamin WITTENBERG ,  Rasamy PHOUTHAVONG ,  Benjamin Shane BUSTLE

IPC: H01R11/01 ,  H01Q1/50 ,  H01R4/48 ,  H01Q1/24

CPC classification number: H01Q1/50 ,  H01Q1/20 ,  H01Q1/243 ,  H01R4/48 ,  H01R11/01

Abstract: The subject matter of the disclosure relates to connectors for antenna feed assemblies and display coupling components of a mobile device. The flexible connectors can be configured with a flexible spring connector component that couples a mobile device antenna to a main logic board of the mobile device within a housing of the mobile device such that the flexible connector can withstand a drop event, while at the same providing for an in-line inductance as part of an antenna-defined design requirement. The display of the mobile device can be coupled to a housing of the mobile device using a pin-screw arrangement that allows the display to controllably shift in the X-direction and the Y-direction, while only being purposefully constrained in the Z-direction (with reference to a 3-dimensional graph having X, Y, and Z axes). This configuration can prevent the display from being pulled out of alignment during a drop event.