公开(公告)号：US12041728B2

公开(公告)日：2024-07-16

申请号：US17160909

申请日：2021-01-28

Applicant: Apple Inc.

Inventor： Maryam Rahimi ,  Meng Chi Lee ,  Wyeman Chen ,  Leilei Zhang ,  Jason P. Marsh ,  Lan Hoang ,  Yashar Abdollahian

IPC: H05K3/34 ,  H05K1/11 ,  H05K3/36

CPC classification number: H05K3/3457 ,  H05K1/113 ,  H05K3/36 ,  H05K2203/10

Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

公开(公告)号：US20210185831A1

公开(公告)日：2021-06-17

申请号：US17160909

申请日：2021-01-28

Applicant: Apple Inc.

Inventor： Maryam Rahimi ,  Meng Chi Lee ,  Wyeman Chen ,  Leilei Zhang ,  Jason P. Marsh ,  Lan Hoang ,  Yashar Abdollahian

IPC: H05K3/34 ,  H05K3/36 ,  H05K1/11

Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

公开(公告)号：US20210043597A1

公开(公告)日：2021-02-11

申请号：US16834471

申请日：2020-03-30

Applicant: Apple Inc.

Inventor： Leilei Zhang ,  Jason P. Marsh ,  Lan Hoang ,  Yashar Abdollahian

IPC: H01L23/00

Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.