公开(公告)号：US12041728B2

公开(公告)日：2024-07-16

申请号：US17160909

申请日：2021-01-28

Applicant: Apple Inc.

Inventor： Maryam Rahimi ,  Meng Chi Lee ,  Wyeman Chen ,  Leilei Zhang ,  Jason P. Marsh ,  Lan Hoang ,  Yashar Abdollahian

IPC: H05K3/34 ,  H05K1/11 ,  H05K3/36

CPC classification number: H05K3/3457 ,  H05K1/113 ,  H05K3/36 ,  H05K2203/10

Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

公开(公告)号：US20210384113A1

公开(公告)日：2021-12-09

申请号：US16892126

申请日：2020-06-03

Applicant: Apple Inc.

Inventor： Leilei Zhang ,  Lan H. Hoang

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/56

Abstract: Electronic package structures and assembly methods are described. In an embodiment, an electronic package includes a die mounted face up on a bottom side of a package substrate, and a plurality of components on a top side of the package substrate. The plurality of components may be unmolded, and available for rework. Additional structures are included within the package substrate to provide mechanical rigidity and robustness to the package for warpage control.

公开(公告)号：US20230026254A1

公开(公告)日：2023-01-26

申请号：US17381931

申请日：2021-07-21

Applicant: Apple Inc.

Inventor： Dennis R. Pyper ,  Leilei Zhang ,  Lan H. Hoang

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/58

Abstract: Flexible modules and methods of manufacture are described. In an embodiment, a flexible module includes a flex board formed in which a passivation layer is applied in liquid form in a panel level process, followed by exposure and development. An electronic component is then mounted onto the flex board and encapsulated in a molding compound that is directly on a top surface of the passivation layer.

公开(公告)号：US20210043597A1

公开(公告)日：2021-02-11

申请号：US16834471

申请日：2020-03-30

Applicant: Apple Inc.

Inventor： Leilei Zhang ,  Jason P. Marsh ,  Lan Hoang ,  Yashar Abdollahian

IPC: H01L23/00

Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

公开(公告)号：US12040262B2

公开(公告)日：2024-07-16

申请号：US17381931

申请日：2021-07-21

Applicant: Apple Inc.

Inventor： Dennis R. Pyper ,  Leilei Zhang ,  Lan H. Hoang

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/58 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10

CPC classification number: H01L23/49822 ,  H01L21/481 ,  H01L21/4857 ,  H01L23/49894 ,  H01L23/58 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4985 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/16227

Abstract: Flexible modules and methods of manufacture are described. In an embodiment, a flexible module includes a flex board formed in which a passivation layer is applied in liquid form in a panel level process, followed by exposure and development. An electronic component is then mounted onto the flex board and encapsulated in a molding compound that is directly on a top surface of the passivation layer.

公开(公告)号：US11462461B2

公开(公告)日：2022-10-04

申请号：US16892126

申请日：2020-06-03

Applicant: Apple Inc.

Inventor： Leilei Zhang ,  Lan H. Hoang

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/31

Abstract: Electronic package structures and assembly methods are described. In an embodiment, an electronic package includes a die mounted face up on a bottom side of a package substrate, and a plurality of components on a top side of the package substrate. The plurality of components may be unmolded, and available for rework. Additional structures are included within the package substrate to provide mechanical rigidity and robustness to the package for warpage control.

公开(公告)号：US20210185831A1

公开(公告)日：2021-06-17

申请号：US17160909

申请日：2021-01-28

Applicant: Apple Inc.

Inventor： Maryam Rahimi ,  Meng Chi Lee ,  Wyeman Chen ,  Leilei Zhang ,  Jason P. Marsh ,  Lan Hoang ,  Yashar Abdollahian

IPC: H05K3/34 ,  H05K3/36 ,  H05K1/11

Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

公开(公告)号：US10602612B1

公开(公告)日：2020-03-24

申请号：US16512280

申请日：2019-07-15

Applicant: Apple Inc.

Inventor： Lan H. Hoang ,  Takayoshi Katahira ,  Leilei Zhang ,  Raghunandan R. Chaware

IPC: H05K1/14 ,  H05K1/11

Abstract: Stacked circuit board structures are described. In an embodiment, a plurality of vertical devices serves as electrical interconnections between the first circuit board and the second circuit board. In an embodiment, a plurality of vertical interconnects or pins serve as electrical interconnections between the first circuit board and the second circuit board. The vertical interconnects or pins may be arranged side-by-side with a plurality of vertical or horizontal devices.