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公开(公告)号：US20250083413A1
公开(公告)日：2025-03-13
申请号：US18588511
申请日：2024-02-27
Applicant: Apple Inc.
Inventor： Todd S. Mintz , Kar-Wai Hon , James A. Curran , Daniel T. McDonald
Abstract: A chemical treatment process has been identified as a simple and effective means of improving the bonding of injection-molded polymer to stainless steel surfaces. This process forms an oxide layer on a stainless steel surface that includes a layered double hydroxide. The layered double hydroxide both raises the bond strength and minimizes air or water leakage. The process enables the use of stainless steel alloys with injection molded polymer structural bonds in strong, lightweight, and water-resistant enclosures for consumer electronics.
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公开(公告)号：US20240229288A1
公开(公告)日：2024-07-11
申请号：US18316530
申请日：2023-05-12
Applicant: Apple Inc.
Inventor： James A. Curran , Kar-Wai Hon , Todd S. Mintz , Isabel Yang
CPC classification number: C25D11/246 , C23C28/00 , C25D11/08 , C25D11/10 , H05K5/04
Abstract: An enclosure for an electronic device includes a titanium-aluminum clad substrate and an anodic oxide coating disposed on the titanium-aluminum clad substrate. The anodic oxide coating includes a density of between about 2.1 g/cm3 and about 2.4 g/cm3 or includes a maximum porosity between about 21% and about 31% and can be exposed to a temperature of over 150° C. without cracking or crazing.
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公开(公告)号：US12252799B2
公开(公告)日：2025-03-18
申请号：US18316530
申请日：2023-05-12
Applicant: Apple Inc.
Inventor： James A. Curran , Kar-Wai Hon , Todd S. Mintz , Isabel Yang
Abstract: An enclosure for an electronic device includes a titanium-aluminum clad substrate and an anodic oxide coating disposed on the titanium-aluminum clad substrate. The anodic oxide coating includes a density of between about 2.1 g/cm3 and about 2.4 g/cm3 or includes a maximum porosity between about 21% and about 31% and can be exposed to a temperature of over 150° C. without cracking or crazing.
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