Abstract:
A display may have an array of organic light-emitting diodes that form an active area on a flexible substrate. Metal traces may extend between the active area and an inactive area of the flexible substrate. Display driver circuitry such as a display driver integrated circuit may be attached to a flexible printed circuit that is attached to the flexible substrate in the inactive area. The metal traces may extend across a bend region in the flexible substrate. The flexible substrate may be bent in the bend region. The flexible substrate may be locally thinned in the bend region. A neutral stress plane adjustment layer may cover the metal traces in the bend region. The neutral stress plane adjustment layer may include polymer layers such as an encapsulation layer, a pixel definition layer, a planarization layer, and a layer that covers a pixel definition layer and planarization layer.
Abstract:
An organic light-emitting diode display may have an array of pixels. Each pixel may have an organic light-emitting diode and thin-film transistor circuitry that controls current flow through the organic light-emitting diode. The thin-film transistor circuitry may include silicon thin-film transistors and semiconducting-oxide thin-film transistors. Double gate transistor structures may be formed in the transistors of the thin-film transistor circuitry. A double gate transistor may have a semiconductor layer sandwiched between first and second dielectric layers. The first dielectric layer may be interposed between an upper gate and the semiconductor layer and the second dielectric layer may be interposed between a lower gate and the semiconductor layer. Capacitor structures may be formed from the layers of metal used in forming the upper and lower gates and other conductive structures.
Abstract:
A display may have an array of light-emitting diode pixels or pixels containing portions of a liquid crystal layer to which electric fields are applied using electrodes. A pixel with a light-emitting diode may have a drive transistor coupled in series with the light-emitting diode. A storage capacitor may be coupled to a gate of the drive transistor. A pixel with a liquid crystal portion may have a storage capacitor coupled to a given one of the electrodes in that pixel. Switching circuitry in each pixel may be used to load data from a data line into the storage capacitor of the pixel. The switching circuitry may include a semiconducting-oxide transistor coupled to an associated data line and a series-connected silicon transistor that is coupled to the storage capacitor.
Abstract:
An organic light-emitting diode display may have an array of pixels. Each pixel may have an organic light-emitting diode with an anode and cathode. The anodes may be formed from a patterned layer of metal. Thin-film transistor circuitry in the pixels may include transistors such as drive transistors and switching transistors. Data lines may supply data signals to the pixels and horizontal control lines may supply control signals to the gates of the transistors. A switching transistor may be coupled between a voltage initialization line and each anode. The voltage initialization lines and capacitor structures in the thin-film transistor circuitry may be formed using a layer of metal that is different than the layer of metal that forms the anodes.
Abstract:
A display may have an array of organic light-emitting diodes that form an active area on a flexible substrate. Metal traces may extend between the active area and an inactive area of the flexible substrate. Display driver circuitry such as a display driver integrated circuit may be attached to a flexible printed circuit that is attached to the flexible substrate in the inactive area. The metal traces may extend across a bend region in the flexible substrate. The flexible substrate may be bent in the bend region. The flexible substrate may be locally thinned in the bend region. A neutral stress plane adjustment layer may cover the metal traces in the bend region. The neutral stress plane adjustment layer may include polymer layers such as an encapsulation layer, a pixel definition layer, a planarization layer, and a layer that covers a pixel definition layer and planarization layer.
Abstract:
A display may have an array of light-emitting diode pixels or pixels containing portions of a liquid crystal layer to which electric fields are applied using electrodes. A pixel with a light-emitting diode may have a drive transistor coupled in series with the light-emitting diode. A storage capacitor may be coupled to a gate of the drive transistor. A pixel with a liquid crystal portion may have a storage capacitor coupled to a given one of the electrodes in that pixel. Switching circuitry in each pixel may be used to load data from a data line into the storage capacitor of the pixel. The switching circuitry may include a semiconducting-oxide transistor coupled to an associated data line and a series-connected silicon transistor that is coupled to the storage capacitor.
Abstract:
An organic light-emitting diode display may have an array of pixels. Each pixel may have an organic light-emitting diode with an anode and cathode. The anodes may be formed from a patterned layer of metal. Thin-film transistor circuitry in the pixels may include transistors such as drive transistors and switching transistors. Data lines may supply data signals to the pixels and horizontal control lines may supply control signals to the gates of the transistors. A switching transistor may be coupled between a voltage initialization line and each anode. The voltage initialization lines and capacitor structures in the thin-film transistor circuitry may be formed using a layer of metal that is different than the layer of metal that forms the anodes.
Abstract:
An electronic device may include a display having an array of display pixels on a substrate. The display pixels may be organic light-emitting diode display pixels or display pixels in a liquid crystal display. In an organic light-emitting diode display, hybrid thin-film transistor structures may be formed that include semiconducting oxide thin-film transistors, silicon thin-film transistors, and capacitor structures. The capacitor structures may overlap the semiconducting oxide thin-film transistors. The silicon transistors may be configured in a top gate arrangement. The oxide transistors may be configured in a top gate or a bottom gate arrangement. In one embodiment, source-drain contacts for the silicon and oxide transistors may be formed simultaneously. In another embodiment, the silicon and oxide thin-film transistor structures may be formed using at least three metal routing layers.
Abstract:
An electronic device may include a display having an array of display pixels on a substrate. The display pixels may be organic light-emitting diode display pixels or display pixels in a liquid crystal display. In an organic light-emitting diode display, hybrid thin-film transistor structures may be formed that include semiconducting oxide thin-film transistors, silicon thin-film transistors, and capacitor structures. The capacitor structures may overlap the semiconducting oxide thin-film transistors. The silicon transistors may be configured in a top gate arrangement. The oxide transistors may be configured in a top gate or a bottom gate arrangement. In one embodiment, source-drain contacts for the silicon and oxide transistors may be formed simultaneously. In another embodiment, the silicon and oxide thin-film transistor structures may be formed using at least three metal routing layers.
Abstract:
An organic light-emitting diode display may have an array of pixels. Each pixel may have an organic light-emitting diode and thin-film transistor circuitry that controls current flow through the organic light-emitting diode. The thin-film transistor circuitry may include silicon thin-film transistors and semiconducting-oxide thin-film transistors. Double gate transistor structures may be formed in the transistors of the thin-film transistor circuitry. A double gate transistor may have a semiconductor layer sandwiched between first and second dielectric layers. The first dielectric layer may be interposed between an upper gate and the semiconductor layer and the second dielectric layer may be interposed between a lower gate and the semiconductor layer. Capacitor structures may be formed from the layers of metal used in forming the upper and lower gates and other conductive structures.