公开(公告)号：US20240421126A1

公开(公告)日：2024-12-19

申请号：US18598938

申请日：2024-03-07

Applicant: Apple Inc.

Inventor： Chi Nung Ni ,  Wei Chen ,  Weiming Chris Chen ,  Vidhya Ramachandran ,  Jie-Hua Zhao ,  Suk-Kyu Ryu ,  Myung Jin Yim ,  Chih-Ming Chung ,  Jun Zhai ,  Young Doo Jeon ,  Seungjae Lee

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/528 ,  H01L23/538 ,  H01L23/58 ,  H01L29/06

Abstract: Integrated circuit (IC) structures, electronic modules, and methods of fabrication are described in which direct bonded interfaces are removed at corners or edges to counteract the potential for non-bonding or delamination. This can be accomplished during singulation, in which a side recess is formed through an entire thickness of an electronic component and into a direct bonded die, followed by final singulation of the IC structure.