公开(公告)号：US20240321564A1

公开(公告)日：2024-09-26

申请号：US18124401

申请日：2023-03-21

Applicant: Applied Materials, Inc.

Inventor： Tobin Kaufman-Osborn ,  MARTIN HILKENE

IPC: H01J37/32

CPC classification number: H01J37/32926 ,  H01J37/32357 ,  H01J37/3244 ,  H01J37/32522 ,  H01J37/32724

Abstract: Embodiments disclosed herein may include a processing tool. In an embodiment, the processing tool includes a chamber, and a remote plasma source (RPS) coupled to the chamber by an adapter. In an embodiment, the processing tool further comprises an RPS match coupled to the RPS, and a first temperature sensor in the chamber. In an embodiment, a second temperature sensor is in the adapter.

公开(公告)号：US20240035896A1

公开(公告)日：2024-02-01

申请号：US17876392

申请日：2022-07-28

Applicant: Applied Materials, Inc.

Inventor： CHUANG-CHIA LIN ,  MARTIN HILKENE ,  AMIR BAYATI

IPC: G01K7/02 ,  H01L21/67 ,  H01J37/32 ,  G01K11/26

CPC classification number: G01K7/021 ,  H01L21/67248 ,  H01J37/32917 ,  G01K11/265

Abstract: Embodiments disclosed herein include sensor devices. In an embodiment, a sensor device comprises a substrate, a first sensor of a first type on the substrate, where a catalytic layer is provided as at least part of the first sensor, a second sensor of the first type on the substrate and adjacent to the first sensor, and a lid over the substrate, where an opening through the lid is provided over the first sensor and the second sensor.