公开(公告)号：US20240109164A1

公开(公告)日：2024-04-04

申请号：US17959076

申请日：2022-10-03

Applicant: Applied Materials, Inc.

Inventor： Chang ZHANG ,  Jian J. CHEN ,  Quoc TRUONG ,  Jamie Stuart LEIGHTON

IPC: B24B49/16 ,  B24B37/30 ,  B24B49/12

CPC classification number: B24B49/16 ,  B24B37/30 ,  B24B49/12

Abstract: A polishing system includes a pressure system, a substrate carrier including a membrane, a first sensor, and a control system. A first compartment of the membrane is fluidly coupled to the pressure system. The first sensor is configured to monitor the pressure system and produce a first output based on conditions detected in the pressure system. The control system coupled to the first sensor and configured to process the first output to produce a first processed output, and the control system configured to compare the first processed output to a threshold to detect a presence of a fluid in the pressure system.

公开(公告)号：US20250010431A1

公开(公告)日：2025-01-09

申请号：US18274991

申请日：2022-08-18

Applicant: Applied Materials, Inc.

Inventor： Jianjun HU ,  Peng LIU ,  Colin John DICKINSON ,  Quoc TRUONG ,  Jamie Stuart LEIGHTON ,  Gopalakrishna B. PRABHU ,  John Howard GIVENS

IPC: B24B57/02 ,  B24B37/005 ,  B24B37/04

Abstract: The present disclosure generally relates to methods and system used to collect and reuse polishing fluids used during a chemical mechanical polishing (CMP) process for the fabrication of electronic devices. More specifically, systems and methods provided herein include a polishing fluid collection system having a catch basin, a vacuum device, and a polishing fluid recycling module for recycling polishing fluid.