公开(公告)号：US20250121472A1

公开(公告)日：2025-04-17

申请号：US18486094

申请日：2023-10-12

Applicant: Applied Materials, Inc.

Inventor： Liu Jiang ,  Prayudi Lianto ,  Santosh Kumar Rath ,  Nina Bao ,  Muhammad Adli Danish ,  Aniruddh Khanna ,  Pin Gian Gan ,  Mohammad Faizal Bin Aermie Ang ,  Mayu Yamamura ,  Sivapackia Ganapathiappan ,  Daniel Redfield ,  El Mehdi Bazizi ,  Yen-Chu Yang ,  Pang Yen Ong ,  Rajeev Bajaj

IPC: B24B37/26 ,  B24B37/22 ,  B24D18/00

Abstract: Printable resin precursor compositions and polishing articles including printable resin precursors are provided that are particularly suited for polishing substrates utilized in hybrid bonding applications. Methods and articles may include a plurality of first polishing elements, where at least one of the plurality of first polymer layers forms the polishing surface; and one or more second polishing elements, where at least a region of each of the one or more second polishing elements is disposed between at least one of the plurality of first polishing elements and a supporting surface of the polishing pad. One or more first polishing elements have a Shore D hardness of greater than 60, one or more second polishing elements have a Shore D hardness of from about 20 to less than 60, and the polishing article has a total Shore D hardness of greater than or about 50.