公开(公告)号：US11072050B2

公开(公告)日：2021-07-27

申请号：US16050442

申请日：2018-07-31

Applicant: Applied Materials, Inc.

Inventor： Boyi Fu ,  Sivapackia Ganapathiappan ,  Daniel Redfield ,  Rajeev Bajaj ,  Ashwin Chockalingam ,  Dominic J. Benvegnu ,  Mario Dagio Cornejo ,  Mayu Yamamura ,  Nag B. Patibandla ,  Ankit Vora

IPC: B24B37/20 ,  B24B37/26 ,  B24B37/24

Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition and the dispensed window precursor composition disposed within the first layer.

公开(公告)号：US11685014B2

公开(公告)日：2023-06-27

申请号：US16529884

申请日：2019-08-02

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Ankit Vora ,  Boyi Fu ,  Venkat Hariharan ,  Mayu Yamamura ,  Mario Cornejo ,  Igor Abramson ,  Mo Yang ,  Daniel Redfield ,  Rajeev Bajaj ,  Nag B. Patibandla

IPC: B24B37/24 ,  C08F283/00 ,  B33Y10/00 ,  B29C64/112 ,  B33Y70/10 ,  B29L31/00 ,  B33Y80/00

CPC classification number: B24B37/24 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/10 ,  C08F283/008 ,  B29L2031/736 ,  B33Y80/00

Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.

公开(公告)号：US10773509B2

公开(公告)日：2020-09-15

申请号：US15452053

申请日：2017-03-07

Applicant: Applied Materials, Inc.

Inventor： Hou T. Ng ,  Nag B. Patibandla ,  Rajeev Bajaj ,  Daniel Redfield ,  Ashwin Chockalingam ,  Mayu Yamamura ,  Mario Cornejo

IPC: B33Y10/00 ,  G03F7/00 ,  G03F7/20 ,  B33Y30/00 ,  B33Y80/00 ,  B24B37/22 ,  B29K105/00

Abstract: A method and apparatus for manufacturing polishing articles used in polishing processes are provided. In one implementation, a method of forming a polishing pad is provided. The method comprises depositing an uncured first layer of a pad forming photopolymer on a substrate. The method further comprises positioning a first optical mask over the first layer of the uncured pad forming photopolymer. The first optical mask includes a patterned sheet of material having at least one aperture. The method further comprises exposing the uncured first layer of the pad forming photopolymer to electromagnetic radiation to selectively polymerize exposed portions of the uncured first layer of the pad forming photopolymer to form pad-supporting structures within the first layer of pad forming photopolymer.

公开(公告)号：US11745302B2

公开(公告)日：2023-09-05

申请号：US17209137

申请日：2021-03-22

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

IPC: B24B37/24 ,  B33Y70/00 ,  B24D3/28 ,  B33Y10/00 ,  B33Y80/00 ,  C09G1/16 ,  B33Y70/10 ,  B29K33/04 ,  B24B37/22 ,  B24B37/26 ,  B29C64/112 ,  B24D11/00 ,  B24D11/04 ,  B29C35/08 ,  C09D4/00

CPC classification number: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B24D3/28 ,  B24D11/001 ,  B24D11/04 ,  B29C35/0805 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C09D4/00 ,  C09G1/16 ,  B24D2203/00 ,  B29C2035/0827 ,  B29K2033/04 ,  B29K2995/0077 ,  B29K2995/0092 ,  B33Y70/10

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US10821573B2

公开(公告)日：2020-11-03

申请号：US14887240

申请日：2015-10-19

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Daniel Redfield ,  Mahendra C. Orilall ,  Boyi Fu ,  Aniruddh Khanna ,  Jason G. Fung ,  Mario Cornejo ,  Ashwin Chockalingam ,  Mayu Yamamura ,  Veera Raghava Reddy Kakireddy ,  Ashavani Kumar ,  Venkat Hariharan ,  Gregory E. Menk ,  Fred C. Redeker ,  Nag B. Patibandla ,  Hou T. Ng ,  Robert E. Davenport ,  Amritanshu Sinha

IPC: B24B37/22 ,  B24B37/24 ,  B24D3/28 ,  B33Y80/00

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

公开(公告)号：US10399201B2

公开(公告)日：2019-09-03

申请号：US15296015

申请日：2016-10-17

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

IPC: B24D3/28 ,  C09D4/00 ,  C09G1/16 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D11/00 ,  B24D11/04 ,  B33Y10/00 ,  B33Y80/00 ,  B29C64/112 ,  B29C35/08 ,  B29K33/04 ,  B33Y70/00

Abstract: Embodiments herein relate to advanced polishing pads with tunable chemical, material and structural properties, and manufacturing methods related thereto. According to one or more embodiments herein, a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments herein thus may provide an advanced polishing pad having discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments herein further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US11772229B2

公开(公告)日：2023-10-03

申请号：US16298802

申请日：2019-03-11

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

IPC: B24B37/24

CPC classification number: B24B37/24

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US11724362B2

公开(公告)日：2023-08-15

申请号：US17114633

申请日：2020-12-08

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Daniel Redfield ,  Mahendra C. Orilall ,  Boyi Fu ,  Aniruddh Jagdish Khanna ,  Jason G. Fung ,  Ashwin Chockalingam ,  Mayu Yamamura ,  Veera Raghava Reddy Kakireddy ,  Gregory E. Menk ,  Nag B. Patibandla

IPC: B24D11/00 ,  B24D11/04 ,  B24D3/28 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B33Y70/00 ,  B33Y10/00 ,  B33Y80/00

CPC classification number: B24D11/001 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D3/28 ,  B24D11/04 ,  B33Y70/00 ,  B33Y10/00 ,  B33Y80/00

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

公开(公告)号：US10953515B2

公开(公告)日：2021-03-23

申请号：US15352647

申请日：2016-11-16

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

IPC: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B29C64/112 ,  B24D3/28 ,  B24D11/00 ,  B24D11/04 ,  B33Y10/00 ,  B33Y80/00 ,  B29C35/08 ,  C09D4/00 ,  C09G1/16 ,  B33Y70/00 ,  B29K33/04

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US20250121472A1

公开(公告)日：2025-04-17

申请号：US18486094

申请日：2023-10-12

Applicant: Applied Materials, Inc.

Inventor： Liu Jiang ,  Prayudi Lianto ,  Santosh Kumar Rath ,  Nina Bao ,  Muhammad Adli Danish ,  Aniruddh Khanna ,  Pin Gian Gan ,  Mohammad Faizal Bin Aermie Ang ,  Mayu Yamamura ,  Sivapackia Ganapathiappan ,  Daniel Redfield ,  El Mehdi Bazizi ,  Yen-Chu Yang ,  Pang Yen Ong ,  Rajeev Bajaj

IPC: B24B37/26 ,  B24B37/22 ,  B24D18/00

Abstract: Printable resin precursor compositions and polishing articles including printable resin precursors are provided that are particularly suited for polishing substrates utilized in hybrid bonding applications. Methods and articles may include a plurality of first polishing elements, where at least one of the plurality of first polymer layers forms the polishing surface; and one or more second polishing elements, where at least a region of each of the one or more second polishing elements is disposed between at least one of the plurality of first polishing elements and a supporting surface of the polishing pad. One or more first polishing elements have a Shore D hardness of greater than 60, one or more second polishing elements have a Shore D hardness of from about 20 to less than 60, and the polishing article has a total Shore D hardness of greater than or about 50.