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    TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY
    1.
    发明申请
    TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY 有权

    公开(公告)号：US20220013374A1

    公开(公告)日：2022-01-13

    申请号：US17483509

    申请日：2021-09-23

    Applicant: Applied Materials, Inc.

    Inventor： Vijay D. PARKHE ,  Konstantin MAKHRATCHEV ,  Masanori ONO ,  Zhiqiang GUO

    IPC: H01L21/67 ,  H01L21/683

    Abstract: Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heater assembly. The substrate support assembly comprises an upper surface and a lower surface; one or more main resistive heaters disposed in the substrate support; and a plurality of heaters in column with the main resistive heaters and disposed in the substrate support. A quantity of the heaters is an order of magnitude greater than a quantity of the main resistive heaters and the heaters are independently controllable relative to each other as well as the main resistive heater.

    TEMPERATURE TUNABLE MULTI-ZONE ELECTROSTATIC CHUCK
    2.
    发明申请
    TEMPERATURE TUNABLE MULTI-ZONE ELECTROSTATIC CHUCK 审中-公开

    公开(公告)号：US20200294836A1

    公开(公告)日：2020-09-17

    申请号：US16352349

    申请日：2019-03-13

    Applicant: Applied Materials, Inc.

    Inventor： Phillip CRIMINALE ,  Zhiqiang GUO ,  Andrew MYLES

    IPC: H01L21/683 ,  H01L21/67 ,  H01L21/66 ,  H05B1/02

    Abstract: Implementations described herein provide a method for calibrating a temperature of a substrate support assembly which enables discrete tuning of the temperature profile of a substrate support assembly. In one embodiment, a system, comprises a memory, wherein the memory includes an application program configured to perform an operation on a substrate support assembly, a control board disposed in a substrate support assembly, wherein the control board comprises a processor having an wireless interface, a pulse width modification (PWM) heater controller, wherein the processor is connected with the memory to read and access the application program from the memory when in operation, and a heating element coupled to the pulse width modification (PWM) heater controller, wherein the heating element comprises a plurality of spatially tunable heaters that are individually tunable by the pulse width modification (PWM) heater controller

    TUNABLE TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY
    3.
    发明申请
    TUNABLE TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY 审中-公开
    可控温度控制基板支持总成

    公开(公告)号：US20160329231A1

    公开(公告)日：2016-11-10

    申请号：US15212946

    申请日：2016-07-18

    Applicant: Applied Materials, Inc.

    Inventor： Vijay D. PARKHE ,  Steven E. BABAYAN ,  Konstantin MAKHRATCHEV ,  Zhiqiang GUO ,  Phillip R. SOMMER ,  Dan A. MAROHL

    IPC: H01L21/683 ,  H05B1/02 ,  H01L21/67

    CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/6831 ,  H05B1/023 ,  H05B1/0233 ,  H05B3/02

    Abstract: Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.

    Abstract translation: 本文所述的实施方案提供了一种基板支撑组件，其能够实现静电卡盘和加热组件之间的热传递的侧向和方位调节。 基板支撑组件包括具有基板支撑表面和下表面的主体，设置在主体中的一个或多个主电阻加热器，设置在主体中的多个可空调的加热器，以及耦合到多个 空间可调谐加热器，空间可调加热器控制器被配置为相对于多个空间可调谐加热器中的另一个来独立地控制多个空间可调加热器中的输出一个。

    TEMPERATURE TUNABLE MULTI-ZONE ELECTROSTATIC CHUCK
    4.
    发明申请
    TEMPERATURE TUNABLE MULTI-ZONE ELECTROSTATIC CHUCK 有权

    公开(公告)号：US20220277982A1

    公开(公告)日：2022-09-01

    申请号：US17750295

    申请日：2022-05-20

    Applicant: Applied Materials, Inc.

    Inventor： Phillip CRIMINALE ,  Zhiqiang GUO ,  Andrew MYLES

    IPC: H01L21/683 ,  H01L21/67 ,  H01L21/66 ,  H05B1/02

    Abstract: Implementations described herein provide a method for calibrating a temperature of a substrate support assembly which enables discrete tuning of the temperature profile of a substrate support assembly. In one embodiment, a system, comprises a memory, wherein the memory includes an application program configured to perform an operation on a substrate support assembly, a control board disposed in a substrate support assembly, wherein the control board comprises a processor having an wireless interface, a pulse width modification (PWM) heater controller, wherein the processor is connected with the memory to read and access the application program from the memory when in operation, and a heating element coupled to the pulse width modification (PWM) heater controller, wherein the heating element comprises a plurality of spatially tunable heaters that are individually tunable by the pulse width modification (PWM) heater controller.

    PIXILATED TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY
    6.
    发明申请
    PIXILATED TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY 审中-公开
    受控温度控制的基板支撑组件

    公开(公告)号：US20150228513A1

    公开(公告)日：2015-08-13

    申请号：US14285606

    申请日：2014-05-22

    Applicant: Applied Materials, Inc.

    Inventor： Vijay D. PARKHE ,  Konstantin MAKHRATCHEV ,  Masanori ONO ,  Zhiqiang GUO

    IPC: H01L21/67 ,  H01L21/683

    CPC classification number: H01L21/67103 ,  H01L21/67248 ,  H01L21/6831

    Abstract: Implementations described herein provide a pixilated substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The pixilated substrate support assembly comprises an upper surface and a lower surface; one or more main resistive heaters disposed in the pixilated substrate support; and a plurality of pixel heaters in column with the main resistive heaters and disposed in the substrate support. A quantity of the pixel heaters is an order of magnitude greater than a quantity of the main resistive heaters and the pixel heaters are independently controllable relative to each other as well as the main resistive heater.

    Abstract translation: 本文所述的实施方式提供了像素化衬底支撑组件，其能够对静电吸盘和加热组件之间的热传递进行横向和方位调节。 像素化衬底支撑组件包括上表面和下表面; 设置在像素化衬底支架中的一个或多个主电阻加热器; 以及具有主电阻加热器的列中的多个像素加热器，并且设置在基板支撑件中。 一些像素加热器的数量级大于主电阻加热器的数量级，并且像素加热器可以相对于彼此独立地被控制以及主电阻加热器。

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