CLIP AND LID SYSTEM FOR A CHIP TRAY
    5.
    发明公开

    公开(公告)号:US20240170315A1

    公开(公告)日:2024-05-23

    申请号:US18551426

    申请日:2022-03-28

    CPC classification number: H01L21/67333

    Abstract: A clip for retaining a chip tray and lid, including in one example a pair of side walls, a rear wall, an upper peripheral edge extending from an upper section of each of the side walls and the rear wall and defining an upper region open area therebetween. A lower peripheral edge extending from a lower section of each of the side walls and the rear wall and defining a lower region open area therebetween. A front opening configured to receive the chip tray and lid. The chip tray has a plurality of pockets configured to hold the semiconductor devices. In one example the lid includes a shock absorbing layer and an electrostatic dissipative layer integrated into an interior of the lid.

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