公开(公告)号：US20230274930A1

公开(公告)日：2023-08-31

申请号：US18004348

申请日：2021-06-29

Applicant: BASF SE

Inventor： Chi Yueh KAO ,  Mei Chin SHEN ,  Andreas KLIPP ,  Haci Osman GUEVENC ,  Daniel LOEFFLER

IPC: H01L21/02 ,  G03F7/40 ,  C11D11/00 ,  C11D7/50 ,  C11D3/37

CPC classification number: H01L21/0206 ,  C11D3/3734 ,  C11D3/3738 ,  C11D7/5022 ,  C11D7/5027 ,  C11D11/0047 ,  G03F7/40

Abstract: Described herein is a non-aqueous composition including

(a) an organic solvent; and
(b) at least one additive of formulae I or II










where

R1 is H
R2 is selected from the group consisting of H, C1 to C10 alkyl, C1 to C10 alkoxy, C6 to C10 aryl, and C6 to C10 aroxy,
R3 is selected from the group consisting of R2,
R4 is selected from the group consisting of C1 to C10 alkyl, C1 to C10 alkoxy, C6 to C10 aryl, and C6 to C10 aroxy,
R10, R12 are independently selected from the group consisting of C1 to C19 alkyl and C1 to C10 alkoxy,
m is 1, 2 or 3, and
n is 0 or an integer from 1 to 100.

公开(公告)号：US20230235252A1

公开(公告)日：2023-07-27

申请号：US17999734

申请日：2021-05-12

Applicant: BASF SE

Inventor： Chi Yueh KAO ,  Mei Chin SHEN ,  Daniel LOEFFLER ,  Andreas KLIPP ,  Haci Osman GUEVENC

IPC: C11D7/04 ,  C11D7/50 ,  C11D11/00 ,  H01L21/02

CPC classification number: C11D7/04 ,  C11D7/5022 ,  C11D11/0047 ,  H01L21/02063

Abstract: Described herein is a method of using a composition including 0.1 to 3% by weight ammonia and a C1 to C4 alkanol. The method includes using the composition for anti-pattern collapse treatment of a substrate including patterned material layers having line-space dimensions with a line width of 50 nm or less, aspect ratios of greater than or equal to 4, or a combination thereof.