公开(公告)号：US20170271625A1

公开(公告)日：2017-09-21

申请号：US15305497

申请日：2015-09-28

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： LU LIU ,  MING CHE HSIEH ,  BAOMING CAI

IPC: H01L51/56 ,  H01L27/32 ,  H01L21/768

Abstract: The present disclosure provides a method for fabricating a display substrate for a display panel. The method includes providing a flexible organic light-emitting diode (flexible OLED) substrate with a thin-film transistor (TFT) layer on the flexible OLED substrate and a patterned adhesive layer on the TFT layer, wherein the TFT layer includes at least one testing area; providing a barrier film (BF) with a patterned laser barrier layer on a surface of the BF, the surface of the BF facing the TFT layer; and bonding the BF onto the flexible OLED substrate such that at least a portion of the patterned laser barrier corresponds to the at least one testing area. The method also includes irradiating a laser beam along a cutting line on the BF to remove a first portion of the BF.

公开(公告)号：US20160359137A1

公开(公告)日：2016-12-08

申请号：US15031252

申请日：2015-09-18

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： LIQIANG CHEN ,  TAO SUN ,  BAOMING CAI

IPC: H01L51/52 ,  H01L25/00 ,  H01L51/56 ,  H01L25/16

CPC classification number: H01L51/5253 ,  H01L21/6835 ,  H01L21/77 ,  H01L23/544 ,  H01L25/167 ,  H01L25/50 ,  H01L27/3276 ,  H01L29/78603 ,  H01L51/524 ,  H01L51/56 ,  H01L2221/6835 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2227/326 ,  H01L2251/5338

Abstract: The present disclosure provides a method for bonding an integrated circuit (IC) chip onto a flexible display body. The method includes providing a substrate having a flexible display body thereon, and aligning a first stiffening component with the flexible display body having an IC bonding region. The method further includes attaching the first stiffening component onto a front surface of the flexible display body, and separating the substrate from the first stiffening component and the flexible display body to expose a back surface of the flexible display body; and bonding an IC chip onto the IC bonding region.

Abstract translation: 本公开提供了一种将集成电路（IC）芯片接合到柔性显示体上的方法。 该方法包括提供其上具有柔性显示体的基板，并且使第一加强部件与具有IC接合区域的柔性显示体对准。 该方法还包括将第一加强部件附接到柔性显示体的前表面上，以及将基板与第一加强部件和柔性显示体分离以露出柔性显示体的后表面; 并将IC芯片接合到IC接合区域上。