公开(公告)号：US20190159352A1

公开(公告)日：2019-05-23

申请号：US16314362

申请日：2017-06-19

Applicant: BYD COMPANY LIMITED

Inventor： Jian SUN ,  Liang CHEN ,  Guiwang ZHAO ,  Yingyuan WU ,  Xiangrong JIANG ,  Yunfei ZOU

IPC: H05K5/02

Abstract: The present disclosure relates to the field of electronic communications, and discloses a housing, a preparation method therefor, and use thereof. The housing includes a metal hard anodic oxide layer (5) and a resin film layer (3) adhering to a first surface of the metal hard anodic oxide layer (5). The metal hard anodic oxide layer (5) and the resin film layer (3) form an integrated structure. The preparation method includes: performing hard anode oxidization treatment on a metal substrate (1), and then successively performing injection molding and etching.

公开(公告)号：US20190232538A1

公开(公告)日：2019-08-01

申请号：US16341826

申请日：2017-09-22

Applicant: BYD COMPANY LIMITED

Inventor： Yingyuan WU ,  Guoqiang ZHANG ,  Guiwang ZHAO ,  Jian SUN ,  Liang CHEN

IPC: B29C45/14 ,  B29C45/00

CPC classification number: B29C45/14344 ,  B29C45/0005 ,  B29C45/0053 ,  B29C45/14 ,  B29C45/1418 ,  B29C69/00 ,  B29C2045/0079 ,  B29K2507/04 ,  B29K2509/08 ,  B29K2705/00 ,  B29L2031/3406

Abstract: The present disclosure provides a metal resin composite. The metal resin composite includes a metal substrate. The upper surface of the metal substrate is provided with at least one upper surface slit, the lower surface of the metal substrate is provided with at least one lower surface groove in a position corresponding to the upper surface slit, and the upper surface slit is connected with the lower surface groove. A first injection molding resin is formed in the upper surface slit by injection molding, and a second injection molding resin is formed in the lower surface groove by injection molding. The present disclosure also provides a preparation method of the metal resin composite, a personal electronic device shell including the metal resin composite, a personal electronic device, and a metal resin composite processing component.

公开(公告)号：US20190322077A1

公开(公告)日：2019-10-24

申请号：US16314358

申请日：2017-06-19

Applicant: BYD COMPANY LIMITED

Inventor： Jian SUN ,  Liang CHEN ,  Guiwang ZHAO ,  Shuai ZHU ,  Xiangrong JIANG

IPC: B32B15/08 ,  H05K5/02 ,  B32B15/20 ,  C25D11/16 ,  C25D11/24 ,  C23F1/02 ,  C23F17/00 ,  C25D11/08

Abstract: The present disclosure relates to the field of electronic communications, and discloses a housing, a preparation method therefor, and use thereof. The housing includes a metal anodic oxide layer (5) and a resin film layer (3) adhering to a first surface of the metal anodic oxide layer (5). The metal anodic oxide layer (5) and the resin film layer (3) form an integrated structure. The preparation method includes: performing anode oxidization treatment on a metal substrate (1), and then successively performing injection molding and etching.