公开(公告)号：US09390993B2

公开(公告)日：2016-07-12

申请号：US14518947

申请日：2014-10-20

Applicant: Broadcom Corporation

Inventor： Sam Ziqun Zhao ,  Galen Kirkpatrick ,  Edward Law ,  Reza Khan ,  Ming Wang Sze

IPC: H01L23/31 ,  H01L21/56 ,  H01L21/683 ,  H01L21/78 ,  H01L23/00 ,  H01L21/66 ,  H01L23/544

CPC classification number: H01L23/3178 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L22/14 ,  H01L23/3114 ,  H01L23/3135 ,  H01L23/3185 ,  H01L23/544 ,  H01L24/14 ,  H01L24/46 ,  H01L24/94 ,  H01L24/95 ,  H01L24/96 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/11002 ,  H01L2224/12105 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2924/00014 ,  H01L2924/10156 ,  H01L2924/181 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/014

Abstract: A semiconductor package includes a semiconductor unit containing an active circuitry layer. The semiconductor package also includes a plurality of bonding pads on the active circuitry layer, which are configured to be connected to corresponding external conductive connectors. The semiconductor package also includes a protective sealant coating filling grooved edges of the active circuitry layer. The protective sealant coating contains an exterior wafer-singulated surface.

Abstract translation: 半导体封装包括包含有源电路层的半导体单元。 半导体封装还包括有源电路层上的多个接合焊盘，其被配置为连接到对应的外部导电连接器。 半导体封装还包括填充有源电路层的沟槽边缘的保护性密封剂涂层。 保护性密封剂涂层包含外部晶片单面。