公开(公告)号：US20130228363A1

公开(公告)日：2013-09-05

申请号：US13781863

申请日：2013-03-01

Applicant: CANON COMPONENTS, INC.

Inventor： Yoshihiro HATTORI ,  Shozo ASAI

IPC: H05K1/02

CPC classification number: H05K1/0277 ,  H01L23/13 ,  H01L23/142 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/4092 ,  H05K2203/1545 ,  H01L2924/00

Abstract: A flexible circuit board includes a base film formed by a metallic material, a first protective film formed on a first surface of the base film, and a circuit pattern adhered to the first protective film through an adhesive film. Projections and recesses for heat release are formed on a second surface that is a surface on the opposite side of the first surface of the base film.

Abstract translation: 柔性电路板包括由金属材料形成的基膜，形成在基膜的第一表面上的第一保护膜和通过粘合膜粘附到第一保护膜的电路图案。 用于放热的突起和凹部形成在作为基膜的第一表面的相对侧上的表面的第二表面上。