公开(公告)号：US20230254460A1

公开(公告)日：2023-08-10

申请号：US18125040

申请日：2023-03-22

Applicant: CASIO COMPUTER CO., LTD.

Inventor： Kohei MIURA ,  Tomoyuki UEDA ,  Hirofumi FUJIKURA

IPC: H04N9/31 ,  G09G3/00

CPC classification number: H04N9/3164 ,  G09G3/001 ,  H04N9/3144

Abstract: A projector includes an optical apparatus, a control circuit board disposed above an upper side of the optical apparatus, a cooling fan disposed near a rear surface outside air inlet port in a case which lies opposite to a projection direction and having an upper surface outside air inlet port configured to let in outside air from an upper surface and a lower surface outside air inlet port configured to let in outside air from a lower surface of the case, and a heat sink provided corresponding to a discharge port of the cooling fan and connected with the optical apparatus, and a flow path resistance on a side facing the lower surface outside air inlet port is smaller than a flow path resistance on a side facing the upper surface outside air inlet port.

公开(公告)号：US20180231232A1

公开(公告)日：2018-08-16

申请号：US15883060

申请日：2018-01-29

Applicant: CASIO COMPUTER CO., LTD.

Inventor： Hirofumi FUJIKURA ,  Kyosuke OGAWA

IPC: F21V31/00 ,  F21K9/00 ,  F21V15/01 ,  F21V29/70 ,  G03B21/20 ,  B23P19/04

CPC classification number: F21V31/005 ,  B23P19/04 ,  F21K9/00 ,  F21V15/01 ,  F21V29/70 ,  F21Y2115/10 ,  G03B21/145 ,  G03B21/2093

Abstract: A light source unit according to an embodiment includes a device holder including a semiconductor light emitting device; a holder case including an opening where the device holder is disposed; and a dustproof member including a frame-shaped dustproof portion disposed in a gap between an outer periphery of the device holder and a wall surface of the opening.

公开(公告)号：US20240111206A1

公开(公告)日：2024-04-04

申请号：US18373426

申请日：2023-09-27

Applicant: CASIO COMPUTER CO., LTD.

Inventor： Hirofumi FUJIKURA ,  Yuta FUKAMI

IPC: G03B21/14 ,  G03B21/16

CPC classification number: G03B21/145 ,  G03B21/16

Abstract: An electronic apparatus includes a first case, a second case provided in such a manner that an internal part is disposed between the first case and the second case, and a cover configured to cover an opposite side of the second case to a side facing the internal part, and a heat conductivity of the second case is higher than a heat conductivity of the cover.

公开(公告)号：US20160344988A1

公开(公告)日：2016-11-24

申请号：US15066024

申请日：2016-03-10

Applicant: CASIO COMPUTER CO., LTD.

Inventor： Toshifumi KASE ,  Hirofumi FUJIKURA

IPC: H04N9/31 ,  H05K13/00 ,  H05K1/02

CPC classification number: H04N9/3144 ,  G03B21/16 ,  H05K13/00

Abstract: An electronic unit is provided including a heat dissipating device having a projecting heat transfer portion, a substrate on one surface side of which the heat dissipating device is disposed and in which an opening portion where the heat transfer portion is inserted is formed, an electronic part disposed on the other surface side of the substrate so that a heat dissipating surface is positioned in the opening portion and connected to the substrate via a frame-shaped connecting portion disposed with a gap between the substrate and itself, and a heat conductive member provided between the heat transfer portion and the heat dissipating surface and between an outer circumference of the heat transfer portion and an inner circumference of the connecting portion, wherein an end portion of the heat conductive member is positioned closer to the heat dissipating device than the gap between the connecting portion and the substrate.

Abstract translation: 提供了一种电子单元，其包括具有突出传热部分的散热装置，其一个表面侧上设置有散热装置的基板，并且其中插入有传热部分的开口部分形成电子部件 设置在基板的另一表面侧，使得散热面位于开口部分中，并且经由设置在基板与其本身之间的间隙的框架形连接部分连接到基板，并且设置在基板之间的导热构件 所述传热部和所述散热面以及所述传热部的外周与所述连接部的内周之间，所述导热部的端部配置在比所述散热部的间隙更靠近所述散热装置的位置 连接部和基板。