公开(公告)号：US11980005B2

公开(公告)日：2024-05-07

申请号：US17528379

申请日：2021-11-17

Applicant: Cisco Technology, Inc.

Inventor： Mehmet Onder Cap ,  Manigandan Boopalan ,  Joel Richard Goergen ,  Sandeep Mehdiratta ,  Manjunatha Reddy Shivashankara ,  Damaruganath Pinjala

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20154 ,  H05K1/0203 ,  H05K2201/066

Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.

公开(公告)号：US11678466B2

公开(公告)日：2023-06-13

申请号：US17329043

申请日：2021-05-24

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Rohit Dev Gupta ,  Narasimha Reddy Emmareddy ,  Manjunatha Reddy Shivashankara ,  Suresh Kumar Vadivazhagan ,  Giovanni Giobbio

IPC: H05K7/20 ,  H01R13/516 ,  G02B6/42

CPC classification number: H05K7/2039 ,  H01R13/516 ,  G02B6/4269

Abstract: In one embodiment, an apparatus includes a heat sink for attachment to an optical module cage configured for receiving an optical module, a thermal interface material attached to a surface of the heat sink for thermal contact with the optical module, and a plurality of lifting elements extending from the surface of the heat sink. The lifting elements are configured to create a gap between the thermal interface material and the optical module during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, the plurality of lifting elements positioned for insertion into aligned recesses in the optical module when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the optical module and the thermal interface material.

公开(公告)号：US11234342B2

公开(公告)日：2022-01-25

申请号：US16842505

申请日：2020-04-07

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Mehmet Onder Cap ,  Manigandan Boopalan ,  Joel Richard Goergen ,  Sandeep Mehdiratta ,  Manjunatha Reddy Shivashankara ,  Damaruganath Pinjala

IPC: H05K7/20 ,  H05K1/02

Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.

公开(公告)号：US20210112682A1

公开(公告)日：2021-04-15

申请号：US16842505

申请日：2020-04-07

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Mehmet Onder Cap ,  Manigandan Boopalan ,  Joel Richard Goergen ,  Sandeep Mehdiratta ,  Manjunatha Reddy Shivashankara ,  Damaruganath Pinjala

IPC: H05K7/20 ,  H05K1/02

Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.

公开(公告)号：US12126117B2

公开(公告)日：2024-10-22

申请号：US17659987

申请日：2022-04-20

Applicant: Cisco Technology, Inc.

Inventor： Garima Mishra ,  Rohit Dev Gupta ,  Shilpa Agrawal ,  Manjunatha Reddy Shivashankara ,  Ramesh Babu Darla

IPC: H01R13/64 ,  H01R13/66 ,  H01R13/717

CPC classification number: H01R13/64 ,  H01R13/6683 ,  H01R13/7175

Abstract: Embodiments herein describe preventing a pluggable module from connecting to a chassis until ensuring there is no damage on the pluggable module, the chassis, or both. In one embodiment, the chassis includes a blocking element that prevents or blocks the pluggable module from mating with the chassis. The chassis can also include a camera for capturing an image of the pluggable module to determine whether there is damage to its connection elements (e.g., pins). If not, the chassis can release the locking pin to permit the pluggable module to mate with connection elements on the chassis.

公开(公告)号：US20220141990A1

公开(公告)日：2022-05-05

申请号：US17329043

申请日：2021-05-24

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Rohit Dev Gupta ,  Narasimha Reddy Emmareddy ,  Manjunatha Reddy Shivashankara ,  Suresh Kumar Vadivazhagan ,  Giovanni Giobbio

IPC: H05K7/20 ,  H01R13/516

Abstract: In one embodiment, an apparatus includes a heat sink for attachment to an optical module cage configured for receiving an optical module, a thermal interface material attached to a surface of the heat sink for thermal contact with the optical module, and a plurality of lifting elements extending from the surface of the heat sink. The lifting elements are configured to create a gap between the thermal interface material and the optical module during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, the plurality of lifting elements positioned for insertion into aligned recesses in the optical module when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the optical module and the thermal interface material.

公开(公告)号：US20240215196A1

公开(公告)日：2024-06-27

申请号：US18596926

申请日：2024-03-06

Applicant: Cisco Technology, Inc.

Inventor： Mehmet Onder Cap ,  Manigandan Boopalan ,  Joel Richard Goergen ,  Sandeep Mehdiratta ,  Manjunatha Reddy Shivashankara ,  Damaruganath Pinjala

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20154 ,  H05K1/0203 ,  H05K2201/066

Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.

公开(公告)号：US20220078941A1

公开(公告)日：2022-03-10

申请号：US17528379

申请日：2021-11-17

Applicant: Cisco Technology, Inc.

Inventor： Mehmet Onder Cap ,  Manigandan Boopalan ,  Joel Richard Goergen ,  Sandeep Mehdiratta ,  Manjunatha Reddy Shivashankara ,  Damaruganath Pinjala

IPC: H05K7/20 ,  H05K1/02

Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.