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公开(公告)号:US11105976B2
公开(公告)日:2021-08-31
申请号:US16842871
申请日:2020-04-08
Applicant: CORNING INCORPORATED
Abstract: A terahertz (THz) waveguide and method for production allows for THz waveguides to be used in or on a printed circuit board (PCB) such that the propagation of THz waves require less power, result in less signal loss due to radiation or dispersion, and propagate more efficiently. Additionally, the position and/or geometry of a waveguide, as well as any additional antenna or coupling element, may be adjusted on or in the PCB such that the electromagnetic field of the waveguide may more efficiently couple with the electromagnetic field of the PCB.
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公开(公告)号:US20210356666A1
公开(公告)日:2021-11-18
申请号:US17391379
申请日:2021-08-02
Applicant: CORNING INCORPORATED
Abstract: A terahertz (THz) waveguide and method for production allows for THz waveguides to be used in or on a printed circuit board (PCB) such that the propagation of THz waves require less power, result in less signal loss due to radiation or dispersion, and propagate more efficiently. Additionally, the position and/or geometry of a waveguide, as well as any additional antenna or coupling element, may be adjusted on or in the PCB such that the electromagnetic field of the waveguide may more efficiently couple with the electromagnetic field of the PCB.
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公开(公告)号:US20210063640A1
公开(公告)日:2021-03-04
申请号:US16842871
申请日:2020-04-08
Applicant: CORNING INCORPORATED
Abstract: A terahertz (THz) waveguide and method for production allows for THz waveguides to be used in or on a printed circuit board (PCB) such that the propagation of THz waves require less power, result in less signal loss due to radiation or dispersion, and propagate more efficiently. Additionally, the position and/or geometry of a waveguide, as well as any additional antenna or coupling element, may be adjusted on or in the PCB such that the electromagnetic field of the waveguide may more efficiently couple with the electromagnetic field of the PCB.
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公开(公告)号:US10288812B1
公开(公告)日:2019-05-14
申请号:US16009953
申请日:2018-06-15
Applicant: CORNING INCORPORATED
Inventor: Alan Frank Evans , Davide Domenico Fortusini , Qijun Xiao
Abstract: Disclosed herein is a fiber optic-to-waveguide coupling assembly with an overlap for edge coupling. The fiber optic-to-waveguide coupling assembly includes a first coupler having a substrate and at least one data fiber, and an interposer with at least one waveguide. A first coupler overlap portion of the substrate is positionable proximate a first interposer overlap portion of the interposer to form a first overlap therebetween to align the at least one data fiber with the at least one waveguide. The substrate and the interposer may each include complementary alignment features to further align the at least one data fiber and the at least one waveguide. The fiber optic-to-waveguide coupling assembly provides simple and accurate alignment with simplified manufacture and assembly.
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公开(公告)号:US20170205583A1
公开(公告)日:2017-07-20
申请号:US15405396
申请日:2017-01-13
Applicant: Corning Incorporated
Inventor: Kevin Wallace Bennett , Alan Frank Evans , Ming-Jun Li , Aramais Robert Zakharian
CPC classification number: G02B6/30 , G02B6/02033
Abstract: A fiber to waveguide coupler is provided that includes an optical fiber having a core and a cladding. The cladding includes an inner cladding and an outer cladding with a polymer. At least one of the core and inner cladding defines a substantially flat surface parallel with an axis of the optical fiber. The optical fiber defines a stripped portion substantially free of outer cladding configured to expose the at least one substantially flat surface of the core or inner cladding. A waveguide is configured to be evanescently coupled with the exposed at least one substantially flat surface of the core or inner cladding.
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公开(公告)号:US08971682B2
公开(公告)日:2015-03-03
申请号:US13775953
申请日:2013-02-25
Applicant: Corning Incorporated
Inventor: Alan Frank Evans , Andrey Evgenievich Korolev , Dmitri Vladislavovich Kuksenkov , Snigdharaj Kumar Mishra , Vladimir Nikolaevich Nazarov , William Allan Wood
CPC classification number: G02B6/0288 , G02B6/02019 , G02B6/02047 , G02B6/0283 , G02B6/03627 , G02B6/0365 , G02B6/03666
Abstract: A few mode optical fiber comprising: a Ge-free core having an effective area Aeff of LP01 mode wherein 120 μm2 ΔrMIN; and |Δ0−ΔOuter-Clad|>0.05%, the relative refractive index profile of the optical fiber is selected to provide attenuation of 1600 nm.
Abstract translation: 一种模式光纤,包括:无Ge芯,其具有LP01模式的有效面积Aeff,其中在1550nm处为120μm2
&Dgr; rMIN; 和|&Dgr; 0-&Dgr;外包层> 0.05%,选择光纤的相对折射率分布,以在1550nm处提供<0.18dB / km的衰减,并且LP11截止波长> 1600nm。 -
公开(公告)号:US11656407B2
公开(公告)日:2023-05-23
申请号:US17391379
申请日:2021-08-02
Applicant: CORNING INCORPORATED
CPC classification number: G02B6/1228 , G02B6/125 , H01P3/16 , H05K1/0274 , G02B2006/12038 , H01P5/08 , H04B3/52
Abstract: A terahertz (THz) waveguide and method for production allows for THz waveguides to be used in or on a printed circuit board (PCB) such that the propagation of THz waves require less power, result in less signal loss due to radiation or dispersion, and propagate more efficiently. Additionally, the position and/or geometry of a waveguide, as well as any additional antenna or coupling element, may be adjusted on or in the PCB such that the electromagnetic field of the waveguide may more efficiently couple with the electromagnetic field of the PCB.
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公开(公告)号:US10545290B2
公开(公告)日:2020-01-28
申请号:US15405396
申请日:2017-01-13
Applicant: Corning Incorporated
Inventor: Kevin Wallace Bennett , Alan Frank Evans , Ming-Jun Li , Aramais Robert Zakharian
Abstract: A fiber to waveguide coupler is provided that includes an optical fiber having a core and a cladding. The cladding includes an inner cladding and an outer cladding with a polymer. At least one of the core and inner cladding defines a substantially flat surface parallel with an axis of the optical fiber. The optical fiber defines a stripped portion substantially free of outer cladding configured to expose the at least one substantially flat surface of the core or inner cladding. A waveguide is configured to be evanescently coupled with the exposed at least one substantially flat surface of the core or inner cladding.
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