公开(公告)号：US20230347622A1

公开(公告)日：2023-11-02

申请号：US17779042

申请日：2020-11-12

Applicant: CORNING INCORPORATED

Inventor： Rocco Lafleur ,  Stephan Lvovich Logunov ,  Brian Nilsen ,  Mark Alejandro Quesada ,  Thomas Mikio Wynne

IPC: B32B7/14 ,  G02B3/12 ,  G02B26/00 ,  B23K26/20 ,  B23K26/211 ,  B32B37/12 ,  B32B38/00 ,  B32B37/24

CPC classification number: B32B7/14 ,  G02B3/12 ,  G02B26/005 ,  B23K26/206 ,  B23K26/211 ,  B32B37/1292 ,  B32B38/0008 ,  B32B37/24 ,  B32B2037/246 ,  B32B2250/02 ,  B32B2255/205 ,  B32B2255/28 ,  B32B2307/202 ,  B32B2310/0843 ,  B32B2309/105 ,  B32B2457/00 ,  B32B2551/00 ,  C03C27/08

Abstract: A bonded article includes a first substrate, a second substrate, and a bonding layer disposed between the first substrate and the second substrate. The bonding layer includes a conducting layer and a capping layer. The first substrate is bonded to the second substrate at a bonded region extending along a bond track. The bonded region is substantially continuous between the first substrate and the second substrate.

公开(公告)号：US20230339796A1

公开(公告)日：2023-10-26

申请号：US18023242

申请日：2021-08-27

Applicant: CORNING INCORPORATED

Inventor： Rocco Lafleur ,  Ernesto Sanchez, Jr.

IPC: C03B29/02 ,  C03C17/06 ,  C03C17/22

CPC classification number: C03B29/025 ,  C03C17/06 ,  C03C17/22

Abstract: A glass package includes a glass body with a rim at least partially circumscribing a cavity and a glass lid with a peripheral portion bonded to the rim and a central portion overlying the cavity. A bond between the lid and the body includes interior and exterior perimeter bonds and a filler bond disposed at least partially between the interior and exterior perimeter bonds. The filler bond includes Sa plurality of first bond paths that are substantially parallel to each other and a plurality of second bond paths that are substantially parallel to each other. The plurality of first bond paths and the plurality of second bond paths intersect each other to form a grid pattern.