公开(公告)号：US20240347926A1

公开(公告)日：2024-10-17

申请号：US18578545

申请日：2021-07-12

Applicant: LG ELECTRONICS INC.

Inventor： Jeayoul JOUNG ,  Ilnam CHO ,  Dongjoo YOU ,  Seongmoon CHO ,  Byeongyong PARK ,  Uisheon KIM

IPC: H01Q21/00 ,  B32B7/12 ,  B32B27/08 ,  B32B27/28 ,  B32B27/32 ,  B32B27/36 ,  H01Q1/22 ,  H01Q21/28

CPC classification number: H01Q21/0006 ,  B32B7/12 ,  B32B27/08 ,  B32B27/281 ,  B32B27/325 ,  B32B27/36 ,  H01Q1/2283 ,  H01Q21/28 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2307/41 ,  B32B2307/412 ,  B32B2307/546 ,  B32B2307/7376 ,  B32B2457/20

Abstract: An antenna apparatus and an image display apparatus including the same are disclosed. An antenna apparatus according to an embodiment of the present disclosure comprises a substrate, a metal mesh disposed on a portion of an upper portion of the substrate, and a protective layer disposed on the metal mesh, wherein the protective layer and the substrate are more transparent than the metal mesh. Accordingly, breakage of a metal mesh inside a transparent antenna apparatus may be reduced.

公开(公告)号：US20240300227A1

公开(公告)日：2024-09-12

申请号：US18600200

申请日：2024-03-08

Applicant: ROBERT DANIEL RUSSELL

Inventor： ROBERT DANIEL RUSSELL

IPC: B32B27/12 ,  B32B5/02 ,  B32B5/26 ,  B32B27/32 ,  E04D12/00

CPC classification number: B32B27/12 ,  B32B5/024 ,  B32B5/028 ,  B32B5/262 ,  B32B27/32 ,  E04D12/002 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2262/0253 ,  B32B2270/00 ,  B32B2307/416 ,  B32B2307/7246 ,  B32B2307/7265 ,  B32B2307/744 ,  B32B2419/06

Abstract: A low-emissivity roofing underlayment comprises a woven reinforcing substrate sandwiched between an aluminized bottom layer and a slip resistant top layer. The bottom, aluminized layer is adapted to be placed against the roof sheathing, facing inward toward the roof rafters, and the slip resistant top layer faces outward and may be walked on by roof shingle installers with a decreased risk of slip and fall accidents, thus permitting safer walking during construction of steeper roofs.

公开(公告)号：US12048132B2

公开(公告)日：2024-07-23

申请号：US17179332

申请日：2021-02-18

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY ,  DREXEL UNIVERSITY

Inventor： Yury Gogotsi ,  Kanit Hantanasirisakul ,  Chong Min Koo ,  Aamir Iqbal ,  Soon Man Hong ,  Seon Joon Kim ,  Seung Sang Hwang ,  Kyung Youl Baek ,  Albert Lee ,  Sangho Cho

IPC: H05K9/00 ,  C01B21/082 ,  C23C16/30

CPC classification number: H05K9/0088 ,  C01B21/0828 ,  C23C16/30 ,  B32B2255/205 ,  C01P2004/04 ,  C01P2006/14 ,  C01P2006/40

Abstract: In an aspect, the present disclosure provides a heat-treated transition metal carbonitride MXene film annealed at high temperatures and a polymer composite comprising the same. In another aspect, the present disclosure provides a method for producing a heat-treated transition metal carbonitride MXene film comprising: obtaining a MXene aqueous solution containing dispersed 2-dimensional (2D) MXenes through an acid etching process; filtering the obtained MXene aqueous solution through a vacuum filtration process to produce a free-standing film; and annealing the produced free-standing film at high temperatures to obtain a heat-treated transition metal carbonitride MXene film. In still another aspect, the present disclosure provides an electromagnetic interference (EMI) shielding method comprising: superposing a coating comprising a heat-treated transition metal carbonitride MXene film on at least one surface of an object in a contact or non-contact manner.

公开(公告)号：US12036780B2

公开(公告)日：2024-07-16

申请号：US17201758

申请日：2021-03-15

Applicant: Ametrine Technologies Ltd.

Inventor： Elad Morag ,  Uria Kaplan

IPC: B32B38/00 ,  B32B3/26 ,  B32B5/26 ,  F41H3/00

CPC classification number: B32B38/0004 ,  B32B3/266 ,  B32B5/275 ,  F41H3/00 ,  B32B2255/02 ,  B32B2255/205 ,  B32B2262/0292 ,  B32B2264/2032

Abstract: A fabric (30) includes a first flexible fabric layer (32), having fabric emissivity properties in a visible radiation range that are selected so as to mimic ambient emissivity properties of a deployment environment of the fabric, and at least one second flexible fabric layer (34), which is joined to the first flexible fabric layer, and which is configured to scatter long-wave radiation that is incident on the fabric. The first and second flexible fabric layers are perforated by a non-uniform pattern of perforations (44) extending over at least a part of the fabric.

公开(公告)号：US12030701B2

公开(公告)日：2024-07-09

申请号：US17193009

申请日：2021-03-05

Applicant: Sonoco Development, Inc.

Inventor： Jacob Donald Prue Branyon

IPC: B65D65/14 ,  B31B50/62 ,  B31B50/74 ,  B32B7/12 ,  B32B9/00 ,  B32B27/08 ,  B32B27/32 ,  B32B27/36 ,  B65B5/02 ,  B65D35/10 ,  B65D35/18 ,  B65D37/00 ,  B65D53/08 ,  B65D75/12 ,  B65D85/60

CPC classification number: B65D65/14 ,  B31B50/62 ,  B31B50/74 ,  B32B7/12 ,  B32B9/00 ,  B32B27/08 ,  B32B27/32 ,  B32B27/36 ,  B65B5/022 ,  B65D35/10 ,  B65D35/18 ,  B65D37/00 ,  B65D53/08 ,  B65D75/12 ,  B65D85/60 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2307/546 ,  B32B2439/70 ,  B65D2575/586

Abstract: A reclosable flexible package is described that includes an inner film layer, an outer film layer laminated to the inner film layer, and reclose region defined in a portion of package film layers. The reclose region includes pressure sensitive adhesive disposed between the inner and outer film layers. A number of cut lines are provided in the outer film layer in the reclose region, such that the user, by manipulating the package film layers at the reclose region, can reveal the underlying layer of pressure sensitive adhesive. Once the pressure sensitive adhesive of the reclose region is exposed, the action of the user can serve to adhere the pressure sensitive adhesive to itself and/or other portions of the film, such that the package is cinched in the area of the reclose region and maintains the remnants of the package contents within the reclosed package for later use.

公开(公告)号：US20240217223A1

公开(公告)日：2024-07-04

申请号：US18606524

申请日：2024-03-15

Applicant: TOPPAN HOLDINGS INC.

Inventor： Yumiko KOJIMA ,  Junichi KAMINAGA ,  Yoshiki KOSHIYAMA ,  Rika ISHII ,  Hiroyuki WAKABAYASHI

IPC: B32B27/10 ,  B32B27/08 ,  B32B27/32 ,  B65D30/08 ,  B65D30/20

CPC classification number: B32B27/10 ,  B32B27/08 ,  B32B27/32 ,  B65D31/02 ,  B65D31/10 ,  B32B2250/02 ,  B32B2255/12 ,  B32B2255/20 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2307/31 ,  B32B2307/718 ,  B32B2307/7244 ,  B32B2307/7246 ,  B32B2307/748

Abstract: A gas barrier laminate that includes a paper substrate; an anchor coat layer containing at least one of a polyvinyl alcohol-based resin, and a polyolefin having polar groups; a vapor deposition layer; an adhesive layer; and a sealant layer laminated in this order.

公开(公告)号：US20240210988A1

公开(公告)日：2024-06-27

申请号：US18129524

申请日：2023-03-31

Applicant: Intel Corporation

Inventor： David Pidwerbecki ,  Arvind S ,  Jeff Ku ,  Juha Tapani Paavola ,  Prakash Kurma Raju ,  Amruta Krishnakumar Ranade ,  Sudheera Sudhakar ,  Mousumi Deka ,  Snehal Chaudhari ,  Akarsha R. Kadadevaramath

IPC: G06F1/16 ,  B32B5/02 ,  B32B5/26 ,  C23C14/20 ,  C23C14/35 ,  C23C16/06

CPC classification number: G06F1/1615 ,  B32B5/02 ,  B32B5/26 ,  C23C14/205 ,  C23C14/35 ,  C23C16/06 ,  B32B2255/02 ,  B32B2255/205 ,  B32B2255/28 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2457/00

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed related to composite materials for electronic device chassis. An example electronic device includes a chassis including a layer of a magnesium alloy or a layer of polyether ether ketone and carbon fiber reinforced plastic and an anodized aluminum coating.

公开(公告)号：US12020999B2

公开(公告)日：2024-06-25

申请号：US17308461

申请日：2021-05-05

Applicant: MATERION CORPORATION

Inventor： Ramesh Kothandapani

IPC: H01L23/10 ,  B23K1/00 ,  B32B3/06 ,  B32B3/26 ,  B32B9/00 ,  B32B9/04 ,  C04B37/02

CPC classification number: H01L23/10 ,  B23K1/00 ,  B32B3/06 ,  B32B3/266 ,  B32B9/005 ,  B32B9/041 ,  C04B37/026 ,  B32B2255/205 ,  B32B2439/00 ,  B32B2457/14 ,  C04B2237/125 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/408 ,  C04B2237/592 ,  C04B2237/708 ,  C04B2237/86 ,  H01L2924/16195

Abstract: A cover lid for use with a semiconductor package is disclosed. First, a polyamide mask is applied to one surface of the lid plate. Next, the exposed areas of the surface, as well as the sides of the lid plate, are metallized. The polyamide mask can then be removed. This reduces pullback and shrinkage of the metallized layer, while lowering the manufacturing cost and process times.

公开(公告)号：US12012256B2

公开(公告)日：2024-06-18

申请号：US17057312

申请日：2020-09-16

Applicant: ZHEJIANG GOLDSTONE PACKAGING CO., LTD.

Inventor： Guojin Sun ,  Can Chen ,  Wenming Zeng ,  Zhigang Xie ,  Miao Ren

IPC: B65D33/01 ,  B32B3/08 ,  B32B5/02 ,  B32B7/12 ,  B32B15/09 ,  B32B15/20 ,  B32B27/08 ,  B32B27/12 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B37/12 ,  B32B38/00 ,  B65D33/25 ,  B65D75/00

CPC classification number: B65D33/01 ,  B32B3/08 ,  B32B5/022 ,  B32B7/12 ,  B32B15/09 ,  B32B15/20 ,  B32B27/08 ,  B32B27/12 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B37/1207 ,  B32B38/164 ,  B65D33/2508 ,  B65D75/008 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2262/0253 ,  B32B2307/31 ,  B32B2307/724 ,  B32B2307/7246 ,  B32B2307/732 ,  B32B2309/02 ,  B32B2311/24 ,  B32B2323/04 ,  B32B2323/10 ,  B32B2367/00 ,  B32B2377/00 ,  B32B2439/06

Abstract: The present invention relates to a dehumidification bag and a preparation method thereof. The dehumidification bag comprises a bag body including a first side sheet and a second side sheet, the side sheet comprises an air-permeability and/or a composite film, wherein at least all or part of at least one side sheet is an air-permeability film; a moisture-proof layer covers the outside of the air-permeability. The dehumidification bag provided by the present invention provides an air-permeability on the bag body, and adopts heat sealing between the outer surface of the air-permeability layer and the moisture-proof layer, so that the air-permeability and the moisture-proof layer are in close contact without moisture absorption, which effectively prevents damage during transportation and storage. In the process, the air-permeability is in contact with the air in the outer bag and the effect of the dehumidifier becomes poor or invalid; by setting the moisture-proof layer to be tearable, when the buyer uses the dehumidification bag, the moisture-proof layer can be torn off, which is convenient and fast.

公开(公告)号：US20240181749A1

公开(公告)日：2024-06-06

申请号：US18286400

申请日：2022-04-12

Applicant: Oji Holdings Corporation

Inventor： Shigeru SUZUKI ,  Yoshikazu FUJISHIRO ,  Kazuyuki HIATE ,  Yoshimune OKUYAMA ,  Masahiro NAKATA ,  Tadakazu ISHIWATA ,  Toshitsugu TAKAGAKI

IPC: B32B15/085 ,  B32B27/32 ,  H01G4/32

CPC classification number: B32B15/085 ,  B32B27/32 ,  H01G4/32 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2307/308 ,  B32B2307/518 ,  B32B2307/54 ,  B32B2307/7376 ,  B32B2457/16

Abstract: Provided is a metallized polypropylene film having excellent insulation breakdown resistance properties. The metallized polypropylene film of the present invention has a thickness of 0.5 to 4.0 μm and has a feature such that the number of insulation breakdown points multiplied by thickness, as determined under predetermined measurement conditions for measuring the number of insulation breakdown points, is 1.90 (points/cm2)·μm or less.