公开(公告)号：US20200181454A1

公开(公告)日：2020-06-11

申请号：US16706991

申请日：2019-12-09

Applicant: Cabot Microelectronics Corporation

Inventor： Cheng-Yuan KO ,  Hung-Tsung HUANG ,  Tyler J. CARTER

IPC: C09G1/02 ,  H01L21/321

Abstract: The invention provides a chemical-mechanical polishing composition comprising(a) an abrasive having a Vickers hardness of 16 GPa or more, and (b) a liquid carrier, wherein the polishing composition is substantially free of an oxidizing agent and wherein the polishing composition has a pH of about 0 to about 7. The invention further provides a method of polishing a substrate, especially a substrate comprising ruthenium, with the polishing composition.