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公开(公告)号:US10281492B2
公开(公告)日:2019-05-07
申请号:US15725650
申请日:2017-10-05
Applicant: Cascade Microtech, Inc.
Inventor: Michael Teich , Karsten Stoll , Walter Matthias Clauss , Swen Schmiedchen
Abstract: Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting assembly extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting assembly includes an electrically conductive support surface, which is configured to support a substrate that includes the DUT. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting assembly.
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公开(公告)号:US09784763B1
公开(公告)日:2017-10-10
申请号:US15094716
申请日:2016-04-08
Applicant: Cascade Microtech, Inc.
Inventor: Michael Teich , Karsten Stoll , Walter Matthias Clauss , Swen Schmiedchen
CPC classification number: G01R1/18 , G01N27/42 , G01N31/02 , G01R1/06711 , G01R1/07378 , G01R1/07392 , G01R1/44
Abstract: Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting stack extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting stack includes an electrically conductive support surface and a temperature-controlled chuck. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting stack.
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公开(公告)号:US20180031608A1
公开(公告)日:2018-02-01
申请号:US15725650
申请日:2017-10-05
Applicant: Cascade Microtech, Inc.
Inventor: Michael Teich , Karsten Stoll , Walter Matthias Clauss , Swen Schmiedchen
CPC classification number: G01R1/18 , G01N27/42 , G01N31/02 , G01R1/06711 , G01R1/07378 , G01R1/07392 , G01R1/44
Abstract: Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting assembly extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting assembly includes an electrically conductive support surface, which is configured to support a substrate that includes the DUT. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting assembly.
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公开(公告)号:US20170292974A1
公开(公告)日:2017-10-12
申请号:US15094716
申请日:2016-04-08
Applicant: Cascade Microtech, Inc.
Inventor: Michael Teich , Karsten Stoll , Walter Matthias Clauss , Swen Schmiedchen
CPC classification number: G01R1/18 , G01N27/42 , G01N31/02 , G01R1/06711 , G01R1/07378 , G01R1/07392 , G01R1/44
Abstract: Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting stack extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting stack includes an electrically conductive support surface and a temperature-controlled chuck. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting stack.
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