摘要:
A packaging structure of an optical motion sensor includes a packaging substrate, an optical detection module, and a packaging mask. The optical detection module is provided on the packaging substrate and is electrically connected with the packaging substrate. The packaging mask is disposed on the packaging substrate to package the optical detection module. Further, the packaging mask is provided therein with a transparent body and a hole formed on the packaging mask. Via the above structure, light, passes through the transparent body inside the hole, and thus shines the optical detection module. In this way, the optical detection module is isolated from dirt in the air, thereby reducing possible damage or interference and reducing the volume of the packaging structure.
摘要:
An electromagnetic wave sensing device and an operating method for the same are disclosed. The claimed device integrates signal transformation, operation and a sensing range configuration. Particularly, the sensing apparatus at least has two sensing units that respectively sense the ambient light and the electromagnetic wave with a specific range of spectrum. Since the output of the sensing device can have a stable characteristic, the downstream manufacturers don't need to use different hardware or software to adapt different product conditions. The preferred embodiment is to provide one electromagnetic wave sensing device having at least two sensing units for respectively sensing different ranges of electromagnetic waves including ambient light or a specific range electromagnetic wave. Further, the respective sensed signals are produced and received by a sensing-signal processing means which performs a photoelectric transformation. After that, data is outputted according to the working mode configured by the sensing-signal processing means.
摘要:
A CIS (Contact Image Sensor) device that doesn't require any optical imaging elements includes a circuit board, a light-emitting module, and an image-sensing module. The light-emitting module is electrically connected with the circuit board. The image-sensing module is electrically connected with the circuit board and disposed beside the light-emitting module. Thereby, a light beam is projected from the light-emitting module to a document to form a bouncing light, and the image-sensing module is adjacent to the document to receive the bouncing light for sensing the image of the document. Hence, the present invention without the known GRIN not only reduces the manufacturing cost and the size of the CIS device, but also solves the known problems of assembly tolerance and large size.
摘要:
A 3D multi-degree of freedom detecting device includes a first electromagnetic radiation source, a second electromagnetic radiation source, a first sensing module, and at least one second sensing module. The first electromagnetic radiation source is used to generate first electromagnetic radiations, and the first electromagnetic radiation source is a point source. The second electromagnetic radiation source is used to generate second electromagnetic radiations, and the second electromagnetic radiation source is a point source. The first sensing module has a plurality of first sensing elements for receiving different radiation energies generated by the first electromagnetic radiations and the second electromagnetic radiations from different spatial angles. The at least one second sensing module has a plurality of second sensing elements for receiving different radiation energies generated by the first electromagnetic radiations and the second electromagnetic radiations from different spatial angles.
摘要:
A motion-detecting device for reducing assembly tolerance includes a connection unit, a light-emitting unit, an image-sensing unit and a positioning unit. The connection unit has a first fixing portion formed on one side thereof and a second fixing portion formed on another side thereof. The second fixing portion has a receiving space and a through hole communicating with the receiving space. The light-emitting unit is fixed in the first fixing portion of the connection unit for generating a projection beam. The image-sensing unit is received in the receiving space of the second fixing portion for capturing images. The positioning unit is positioned over the receiving space of the second fixing portion and electrically connected to the image-sensing unit. The transparent base is disposed under the connection unit and mated with the second fixing portion of the connection unit.
摘要:
A motion-detecting module includes a PCB, a light-emitting unit, and a light-sensing unit. The light-emitting unit is electrically disposed over the PCB. The light-sensing unit has a light-sensing die electrically disposed on the PCB and a package cover covered on the light-sensing die, and the package cover has a through hole corresponding to the light-sensing die and a transparent element disposed in the through hole. The present invention does not need extra package protection body of the prior art for protecting the light-sensing die during the transport of the light-sensing module. The present invention use original package cover to prevent the light-sensing die from being damaged by external force, and the original package cover shelters the light-sensing die from extra stray light.
摘要:
A motion detection method makes use of a reference sensor and a plurality of comparison sensors of a motion detection module to capture detection data. With the operation of a domain transformation and the use of discriminants (for direction, the number of times of movement, and speed), the number of sensors used can be decreased, and it is not necessary to use sensors with good uniformity. Moreover, conventional complicated algorithms can be simplified, and the influence on original detection data due to environment, electric noise and difference between sensors can be avoided, thereby precisely calculating out the motion direction and speed of the motion detection module.
摘要:
An optical motion identification device utilizing partial total internal reflection light source and/or partial non-total internal reflection light source includes a light-emitting member, a code member and a light-sensing unit. The light-emitting member generates projecting light beams. The code member receives the projecting light beams generated by the light-emitting member at different angles and positions, and the code member has many total internal reflection surfaces in order to make the projecting light beams form many partial total internal reflection beams and a plurality of partial non-total internal reflection beams. The light-sensing unit disposes beside the code member for detecting the light intensity distribution of the partial total internal reflection beams and/or the partial non-total internal reflection beams projected on the light-sensing unit in order to determining a direction, a displacement, or a rotation angle of a movement of the code member relative to the light-emitting member or the light-sensing unit.
摘要:
A motion-detecting module with a built-in light source includes a chip unit, a cover unit, and a light-guiding unit. The chip unit has a PCB, a light-emitting chip, and an image-sensing chip. The light-emitting chip and the image-sensing chip are electrically disposed on the PCB. The cover unit is covered on the image-sensing chip, and the cover unit has a first opening for exposing the image-sensing chip. The light-guiding unit is disposed on a bottom side of the cover unit, and the light-guiding unit has a surface having a reflective layer thereon with a concave structure. The surface and the reflective layer are formed a reflective surface for reflecting and condensing beams generated from the light-emitting chip. Therefore, the beams are reflected via the reflective surface to form first beams, and the first beams are reflected via the object surface to form second beams that project onto the image-sensing chip.
摘要:
A contact image-sensing module having fingerprint-scanning function is described. The image-sensing module has a flex/rigid composite substrate having a first rigid circuit substrate, a second rigid circuit substrate, a third rigid circuit substrate, and at least one flex circuit board. The first rigid circuit substrate, the second rigid circuit substrate, and the third rigid circuit substrate respectively and electrically connect to the flex circuit board in order to form a first composite substrate, a second composite substrate, and a third composite substrate. Each of the second composite substrate and the third composite substrate respectively is not located in the same plane and has a predetermined angle with respect to the plane where the first composite plane is located.