公开(公告)号：US20130161837A1

公开(公告)日：2013-06-27

申请号：US13490810

申请日：2012-06-07

申请人： Chia-Yin Chen ,  Yu-Ching Liu ,  Yueh-Chiung Chang ,  Yu-Po Wang

发明人： Chia-Yin Chen ,  Yu-Ching Liu ,  Yueh-Chiung Chang ,  Yu-Po Wang

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L24/03 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/03462 ,  H01L2224/03552 ,  H01L2224/0381 ,  H01L2224/03831 ,  H01L2224/04042 ,  H01L2224/27013 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A packaging substrate and a semiconductor package using the packaging substrate are provided. The packaging substrate includes: a substrate body having a die attach area, a circuit layer formed around the die attach area and having a plurality of conductive traces each having a wire bonding pad, and a surface treatment layer formed on the wire bonding pads. Therein, only one of the conductive traces is connected to an electroplating line so as to prevent cross-talk that otherwise occurs between conductive traces due to too many electroplating lines in the prior art.

摘要翻译： 提供了使用封装基板的封装基板和半导体封装。 封装基板包括：具有管芯附着区域的基板主体，形成在管芯附着区域周围的电路层，并且具有多个导线，每个导线具有引线焊盘，以及形成在引线接合焊盘上的表面处理层。 其中，仅有一个导电迹线连接到电镀线，以便防止由于现有技术中的电镀线太多导致的导电迹线之间的串扰。

公开(公告)号：US08901729B2

公开(公告)日：2014-12-02

申请号：US13490810

申请日：2012-06-07

申请人： Chia-Yin Chen ,  Yu-Ching Liu ,  Yueh-Chiung Chang ,  Yu-Po Wang

发明人： Chia-Yin Chen ,  Yu-Ching Liu ,  Yueh-Chiung Chang ,  Yu-Po Wang

IPC分类号： H01L23/48

CPC分类号： H01L24/03 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/03462 ,  H01L2224/03552 ,  H01L2224/0381 ,  H01L2224/03831 ,  H01L2224/04042 ,  H01L2224/27013 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A packaging substrate and a semiconductor package using the packaging substrate are provided. The packaging substrate includes: a substrate body having a die attach area, a circuit layer formed around the die attach area and having a plurality of conductive traces each having a wire bonding pad, and a surface treatment layer formed on the wire bonding pads. Therein, only one of the conductive traces is connected to an electroplating line so as to prevent cross-talk that otherwise occurs between conductive traces due to too many electroplating lines in the prior art.

摘要翻译： 提供了使用封装基板的封装基板和半导体封装。 封装基板包括：具有管芯附着区域的基板主体，形成在管芯附着区域周围的电路层，并且具有多个导线，每个导线具有引线焊盘，以及形成在引线接合焊盘上的表面处理层。 其中，仅有一个导电迹线连接到电镀线，以便防止由于现有技术中的电镀线太多导致的导电迹线之间的串扰。

公开(公告)号：US4929728A

公开(公告)日：1990-05-29

申请号：US430285

申请日：1989-11-02

申请人： Ji-Wang Chern ,  Kang-Chien Liu ,  Chia-Yin Chen

发明人： Ji-Wang Chern ,  Kang-Chien Liu ,  Chia-Yin Chen

IPC分类号： C07D403/04

CPC分类号： C07D403/04

摘要： A process for preparing 3-(1H-tetrazol-5-yl)-4(3H)-quinazolinone ammonium salts of the formula I: ##STR1## wherein: R is hydrogen, halogen, C.sub.1 -C.sub.3 alkyl or C.sub.1 -C.sub.3 alkoxy,which process comprises:reacting ethyl N-(1H-tetrazol-5-yl) formimidate in an inert solvent with substituted anthranilamide of the formula IV ##STR2## wherein R is as defined above. The process is simpler than prior processes for preparing the same compounds and thus is economically valuable.

摘要翻译： 制备式I的3-（1H-四唑-5-基）-4（3H） - 喹唑啉酮铵盐的方法：其中：R是氢，卤素，C 1 -C 3烷基或C 1 -C 3烷基， C3烷氧基，该方法包括：使N-（1H-四唑-5-基）甲亚胺酸乙酯在惰性溶剂中与取代的式IV化合物（IV）反应，其中R如上定义。 该方法比用于制备相同化合物的先前方法简单，因此在经济上是有价值的。