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公开(公告)号：US11337010B2
公开(公告)日：2022-05-17
申请号：US16605155
申请日：2018-04-13
Inventor： Marek Sebastian Piechocinski , Roberto Brioschi , Rkia Achehboune
Abstract: The present disclosure describes techniques for altering the epoxy wettability of a surface of a MEMS device. Particularly applicable to flip-chip bonding arrangements in which a top surface of a MEMS device is adhered to a package substrate. A barrier region is provided on a top surface of the MEMs device, laterally outside a region which forms, or overlies, the backplate and/or the cavity in the transducer substrate. The barrier region comprises a plurality of discontinuities, e.g. dimples, which inhibit the flow of epoxy.
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公开(公告)号：US11252513B2
公开(公告)日：2022-02-15
申请号：US16823588
申请日：2020-03-19
Inventor： Roberto Brioschi , Rkia Achehboune , David Patten
Abstract: The application relates to a MEMS transducer package comprising: a package substrate the package substrate comprising a substrate channel, the substrate channel comprising first and second channel portions, wherein the first portion extends in a first direction between a first channel opening in a side surface of the substrate and a junction between the first and second channel portions, and wherein the second portion extends in a second direction between said junction and a second channel opening at, or underlying, a substrate opening provided in an upper surface of the package substrate.
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公开(公告)号：US11299392B2
公开(公告)日：2022-04-12
申请号：US16869075
申请日：2020-05-07
Inventor： Rkia Achehboune , Roberto Brioschi , Dimitris Drogoudis , David Patten
Abstract: The Application describes a substrate design for a MEMS transducer package. The substrate is defined by a conductive layer which forms the upper and lower surfaces of the substrate. The substrate is also provided with a conductive portion which is electrically isolated from the rest of the conductive layer. The conductive portion is supported between a first plane defined by the upper surface of the substrate and a second plane defined by the lower surface of the substrate by an electrically insulating moulding substance.
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公开(公告)号：US11146894B2
公开(公告)日：2021-10-12
申请号：US16823971
申请日：2020-03-19
Inventor： Roberto Brioschi , Rkia Achehboune
Abstract: The present application describes a MEMS transducer package having a substrate layer which defines a recess. The recess extends in the plane of the substrate layer and defines a channel for directing sound waves that are incident on a side surface of the package substrate.
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公开(公告)号：US20180167744A1
公开(公告)日：2018-06-14
申请号：US15832186
申请日：2017-12-05
Inventor： Marek Sebastian Piechocinski , Roberto Brioschi , Rkia Achehboune , Aleksey Sergeyevich Khenkin
Abstract: The application describes a lid for a transducer package, wherein an interior surface of the lid is provided with a plurality of dimples. The dimples are provided in a ceiling surface of the lid or in a side-wall surface of the lid. The dimples may be arranged to form a regular array. The dimples serve to create a turbulent boundary layer to decouple the interior surface of lid from airflow arising inside the package chamber, thus alleviating noise.
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Patent Agency Ranking
公开(公告)号：US11814284B2
公开(公告)日：2023-11-14
申请号：US16825593
申请日：2020-03-20
Inventor： Roberto Brioschi , Rkia Achehboune
CPC classification number: B81C1/0023 , B81B3/0021 , B81C1/00253 , H01L24/19 , H04R19/005 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , H01L2924/1461 , H04R2201/003
Abstract: The application relates to structures, e.g. substrates for supporting semiconductor die. The substrate defines a frame which lateral surrounds one or more die and is provided in contact with at least one side surface of the die, wherein the frame defines upper and lower surfaces of the substrate.
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公开(公告)号：US11223907B2
公开(公告)日：2022-01-11
申请号：US16822771
申请日：2020-03-18
Inventor： Rkia Achehboune , Roberto Brioschi
Abstract: The present application relates to structures for supporting mechanical, electrical and/or electromechanical components, devices and/or systems and to methods of fabricating such structures. The application describes a primary die comprising an aperture extending through the die. The aperture is suitable for receiving a secondary die. A secondary die may be provided within the aperture of the primary die.
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公开(公告)号：US10252906B2
公开(公告)日：2019-04-09
申请号：US15788499
申请日：2017-10-19
Inventor： Roberto Brioschi , David Patten , Rkia Achehboune
Abstract: The application describes a package design for a MEMS transducer having an integrated circuit mounted within a chamber of the package. The integrated circuit may extend into a side wall recess of the package.
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公开(公告)号：US11736866B2
公开(公告)日：2023-08-22
申请号：US17520386
申请日：2021-11-05
Inventor： Rkia Achehboune , Roberto Brioschi
CPC classification number: H04R19/04 , B81B7/0058 , B81B7/0061 , B81B7/0064 , B81B2201/0257 , B81B2203/0127 , B81B2203/0315 , B81B2207/012 , H04R2201/003
Abstract: The present application relates to structures for supporting mechanical, electrical and/or electromechanical components, devices and/or systems and to methods of fabricating such structures. The application describes a primary die comprising an aperture extending through the die. The aperture is suitable for receiving a secondary die. A secondary die may be provided within the aperture of the primary die.
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公开(公告)号：US11172314B2
公开(公告)日：2021-11-09
申请号：US16825549
申请日：2020-03-20
Inventor： Roberto Brioschi , Rkia Achehboune
Abstract: The application describes a package substrate for a MEMS transducer package having a recessed region formed in an upper surface of the package substrate. The recessed region extends only partially through the package substrate from an opening in the upper surface of the package substrate in a first direction towards the lower surface of the substrate. The recessed region extends only partially through the package substrate from an opening in a side surface of the package substrate in a second direction towards an opposite side surface.
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