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1.发明授权Power doubler amplifier module with improved solder coverage between a heat sink and a thermal pad of a circuit package 有权功率倍增器放大器模块，其具有在散热器和电路封装的散热焊盘之间的焊接覆盖率的改善公开(公告)号：US09431317B2
公开(公告)日：2016-08-30
申请号：US14074057
申请日：2013-11-07
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Hujiao Wang , David A. Holtzclaw , Wei Qi , Benjamin Lee Davis , John MacKay
IPC: H05K7/20 , H01L23/367 , H01L23/13 , H01L23/40 , H01L23/42
CPC classification number: H01L23/3675 , H01L23/13 , H01L23/4006 , H01L23/42 , H01L2023/405 , H01L2023/4068 , H01L2924/0002 , H01L2924/00
Abstract: In one embodiment, an apparatus includes a printed circuit board, and a circuit package mounted to the printed circuit board. The circuit package has a thermal pad. A first heat sink structure of the module is associated with the printed circuit board and has a wall defining a contact surface that contacts and thermally couples with the thermal pad. The wall includes at least one aperture there-through. Solder paste is provided between the contact surface and the thermal pad to bond the contact surface to the thermal pad, with the at least one aperture being constructed and arranged to aid in outgassing of the solder paste.
Abstract translation: 在一个实施例中，装置包括印刷电路板和安装到印刷电路板的电路封装。 电路封装有一个散热垫。 模块的第一散热器结构与印刷电路板相关联并且具有限定与热垫接触并热耦合的接触表面的壁。 墙壁至少包括一个孔。 在接触表面和热垫之间提供焊膏以将接触表面粘合到热垫上，其中至少一个孔被构造和布置成有助于使焊膏脱气。
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2.发明申请POWER DOUBLER AMPLIFIER MODULE WITH IMPROVED SOLDER COVERAGE BETWEEN A HEAT SINK AND A THERMAL PAD OF A CIRCUIT PACKAGE 有权电源双极放大器模块，具有改进的散热片与散热片与热电偶套管之间的焊接覆盖公开(公告)号：US20150124410A1
公开(公告)日：2015-05-07
申请号：US14074057
申请日：2013-11-07
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Hujiao Wang , David A. Holtzclaw , Wei Qi , Benjamin Lee Davis , John MacKay
IPC: H05K7/20
CPC classification number: H01L23/3675 , H01L23/13 , H01L23/4006 , H01L23/42 , H01L2023/405 , H01L2023/4068 , H01L2924/0002 , H01L2924/00
Abstract: In one embodiment, an apparatus includes a printed circuit board, and a circuit package mounted to the printed circuit board. The circuit package has a thermal pad. A first heat sink structure of the module is associated with the printed circuit board and has a wall defining a contact surface that contacts and thermally couples with the thermal pad. The wall includes at least one aperture there-through. Solder paste is provided between the contact surface and the thermal pad to bond the contact surface to the thermal pad, with the at least one aperture being constructed and arranged to aid in outgassing of the solder paste.
Abstract translation: 在一个实施例中，装置包括印刷电路板和安装到印刷电路板的电路封装。 电路封装有一个散热垫。 模块的第一散热器结构与印刷电路板相关联并且具有限定与热垫接触并热耦合的接触表面的壁。 墙壁至少包括一个孔。 在接触表面和热垫之间提供焊膏以将接触表面粘合到热垫上，其中至少一个孔被构造和布置成有助于使焊膏脱气。
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