公开(公告)号：US11756861B2

公开(公告)日：2023-09-12

申请号：US17663072

申请日：2022-05-12

Applicant: Cisco Technology, Inc.

Inventor： Ashley J. M. Erickson ,  Matthew J. Traverso ,  Sandeep Razdan ,  Joyce J. M. Peternel ,  Aparna R. Prasad

IPC: H01L23/473 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L21/78 ,  H01L23/544

CPC classification number: H01L23/473 ,  H01L21/4803 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/544 ,  H01L24/32 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2223/54426 ,  H01L2224/32225

Abstract: An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.

公开(公告)号：US11831093B2

公开(公告)日：2023-11-28

申请号：US17645195

申请日：2021-12-20

Applicant: Cisco Technology, Inc.

Inventor： Matthew J. Traverso ,  Sandeep Razdan ,  Joyce J. M. Peternel

IPC: H01R12/70 ,  G02B6/38

CPC classification number: H01R12/7005 ,  G02B6/3817

Abstract: An apparatus includes a substrate, a frame, and a socket. The frame defines a slot. The frame is coupled to the substrate such that the slot is aligned with an attachment location on the substrate. The socket receives a first device. The socket aligns with the attachment location on the substrate when the socket is inserted in the slot.

公开(公告)号：US09256039B2

公开(公告)日：2016-02-09

申请号：US13734128

申请日：2013-01-04

Applicant: Cisco Technology, Inc.

Inventor： Joyce J. M. Peternel ,  Yong M. Jeon

IPC: G02B6/42

CPC classification number: G02B6/4257 ,  G02B6/4246 ,  G02B6/4277 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49826

Abstract: A device including a port barrel, a ball spring, a first enclosure part, and a mounting plate disposed adjacent to the first enclosure part is disclosed. The mounting plate includes a mounting hole. The port barrel is arranged to extend through the mounting hole, and the ball spring is arranged between an inner surface of the mounting hole and an exterior surface of the port barrel.

Abstract translation: 公开了一种包括端口桶，球弹簧，第一外壳部件和邻近第一外壳部件设置的安装板的装置。 安装板包括安装孔。 端口筒布置成延伸穿过安装孔，并且球形弹簧布置在安装孔的内表面和端口筒的外表面之间。

公开(公告)号：US11373930B2

公开(公告)日：2022-06-28

申请号：US16836825

申请日：2020-03-31

Applicant: Cisco Technology, Inc.

Inventor： Ashley J. M. Erickson ,  Matthew J. Traverso ,  Sandeep Razdan ,  Joyce J. M. Peternel ,  Aparna R. Prasad

IPC: H01L23/473 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L21/78 ,  H01L23/544

Abstract: An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.

公开(公告)号：US11215775B2

公开(公告)日：2022-01-04

申请号：US16544699

申请日：2019-08-19

Applicant: Cisco Technology, Inc.

Inventor： Ashley J. Maker ,  Joyce J. M. Peternel ,  Sandeep Razdan ,  Matthew J. Traverso ,  Aparna R. Prasad

IPC: G02B6/42

Abstract: An optical connection assembly joining optical components is described. The optical connection assembly is manufactured using a fan out wafer level packaging to produce dies/frames which include mechanical connection features. A fastener is joined to a connection component and affixed to the mechanical connection features, to provide structural support to the connection between the connected component and the die/frame structure.