摘要:
A frequent problem that arises in particular with regard to the analysis of memory components is that the memory components have to be tested under realistic conditions in a real application environment. In practice, such components are normally firmly soldered in on a module carrier. Owing to the thermal load during soldering, this solution cannot always be used and, furthermore, the contacts that are made should be detachable. Commercially available contact bases with detachable contacts cannot be used, however, since their dimensions are too large and they do not fit in the available surface area on the module carrier. The novel contact base is sufficiently small that a plurality of contact bases can be arranged closely one next to the other in a row in a very small space on a module carrier. The module carrier has plug contacts to be plugged into a commercial socket in order to make contact.
摘要:
An additional test mode is introduced in a semiconductor memory. A multiplicity of word lines are simultaneously activated by a word line decoder in the test mode. After a potential equalization of complementary bit lines, a logic “0” or a logic “1” is applied to an equalization circuit via a voltage generator. It is thus possible for the entire memory cell array to be preallocated an identical data value or, in strip form, alternating data values. Test time is thereby saved.