公开(公告)号：US11335833B2

公开(公告)日：2022-05-17

申请号：US16118779

申请日：2018-08-31

Applicant: CreeLED, Inc.

Inventor： Sung Chul Joo ,  Kenneth M. Davis ,  David Suich ,  Jae-Hyung Park ,  Arthur F. Pun

IPC: H01L33/10 ,  H01L33/50 ,  H01L33/62 ,  H01L33/36 ,  H01L25/075

Abstract: Light-emitting diodes (LEDs), LED arrays, and related devices are disclosed. An LED device includes a first LED chip and a second LED chip mounted on a submount with a light-altering material in between. The light-altering material may include at least one of a light-reflective material and/or a light-absorbing material. Individual wavelength conversion elements may be arranged on each of the first and second LED chips. The light-altering material may improve the contrast between the first and second LED chips as well as between the individual wavelength conversion elements. LED devices may include submounts in modular configurations where LED chips may be mounted on adjacent submounts to form an LED array. Each LED chip of the LED array may be laterally separated from at least one other LED chip by a same distance and a light-altering material may be arranged around the LED array.

公开(公告)号：US12176472B2

公开(公告)日：2024-12-24

申请号：US17238934

申请日：2021-04-23

Applicant: CreeLED, Inc.

Inventor： Roshan Murthy ,  Kenneth M. Davis ,  Jae-Hyung Park ,  Xiameng Shi

IPC: H01L33/62 ,  G02B5/02 ,  G02B27/09 ,  H01L21/66 ,  H01L23/00 ,  H01L25/075 ,  H01L25/16 ,  H01L27/02 ,  H01L33/10 ,  H01L33/50 ,  H01L33/60 ,  H01L33/64

Abstract: Solid state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs are disclosed. In some embodiments, an LED package includes electrical connections that are configured to reduce corrosion of metals within the LED package; or decrease the overall forward voltage of the LED package; or provide an electrical path for serially-connected electrostatic discharge (ESD) chips. In some embodiments, an LED package includes at least two LED chips and a material between the two LED chips that promotes homogeneity of composite emissions from the two LED chips. In this manner, LED packages according to the present disclosure may be beneficial for various applications, including those where a high luminous intensity is desired in a variety of environmental conditions. Such applications include automotive lighting, aerospace lighting, and general illumination.

公开(公告)号：US20210265544A1

公开(公告)日：2021-08-26

申请号：US17238934

申请日：2021-04-23

Applicant: CreeLED, Inc.

Inventor： Roshan Murthy ,  Kenneth M. Davis ,  Jae-Hyung Park ,  Xiameng Shi

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L33/64 ,  H01L21/66 ,  H01L33/50 ,  H01L33/60 ,  H01L27/02 ,  G02B5/02 ,  G02B27/09 ,  H01L23/00 ,  H01L33/10

Abstract: Solid state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs are disclosed. In some embodiments, an LED package includes electrical connections that are configured to reduce corrosion of metals within the LED package; or decrease the overall forward voltage of the LED package; or provide an electrical path for serially-connected electrostatic discharge (ESD) chips. In some embodiments, an LED package includes at least two LED chips and a material between the two LED chips that promotes homogeneity of composite emissions from the two LED chips. In this manner, LED packages according to the present disclosure may be beneficial for various applications, including those where a high luminous intensity is desired in a variety of environmental conditions. Such applications include automotive lighting, aerospace lighting, and general illumination.