公开(公告)号：US20240355979A1

公开(公告)日：2024-10-24

申请号：US18304836

申请日：2023-04-21

Applicant: CreeLED, Inc.

Inventor： Robert Wilcox ,  Michael Check ,  Andre Pertuit ,  David Suich ,  Joseph G. Sokol ,  Colin Blakely

IPC: H01L33/62 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L33/56

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED packages with materials for reducing effects of environmental ingress are disclosed. Reactive materials are provided within LED packages that preferentially absorb environmental ingress away from other package elements, thereby extending operating lifetimes. Such reactive materials may be configured with redox potentials that are lower than the other package elements to more readily attract and react with environmental ingress that may enter LED packages under various operating environments. Arrangements of reactive materials are described relative to LED chips and corresponding electrical connections. Reactive materials may be formed as coatings, layers, pre-formed structures, and/or distributions of particles within LED packages.

公开(公告)号：US20240266462A1

公开(公告)日：2024-08-08

申请号：US18104966

申请日：2023-02-02

Applicant: CreeLED, Inc.

Inventor： Michael Check ,  David Suich ,  Colin Blakely ,  Joseph Sokol ,  Robert Wilcox ,  Andre Pertuit

IPC: H01L33/00

CPC classification number: H01L33/007 ,  H01L33/0093 ,  H01L2933/0058

Abstract: Solid-state lighting devices, and more particularly to laser etching light-emitting diode (LED) devices and related methods are disclosed. LED devices that use sapphire substrates are difficult to etch using conventional techniques, but laser etching and ablation of sapphire substrates overcomes these challenges. Laser etching a surface of the sapphire substrate can form light-extraction features that include structures formed in or on light-emitting surfaces of substrates. Light-extraction features may include repeating patterns of features with dimensions that, along with reduced substrate thicknesses, provide targeted emission profiles for flip-chip structures, such as Lambertian emission profiles. In some embodiments, laser ablation of the sapphire substrate can also be used to form trenches between active layer portions of an LED matrix to form pixels that reduce interference between the active layer portions. The trenches can further be filled with materials with light-altering properties to further refine the desired emission characteristics.

公开(公告)号：USD1036711S1

公开(公告)日：2024-07-23

申请号：US29877887

申请日：2023-06-13

Applicant: CreeLED, Inc.

Designer： Thomas Celano ,  Alexis Rile ,  Derek Miller ,  David Suich ,  Colin Blakely ,  Sarah Trinkle ,  Robert Wilcox

Abstract: FIG. 1 is a top perspective view of one embodiment of a light-emitting diode package;
FIG. 2 is a bottom perspective view of the light-emitting diode package of FIG. 1;
FIG. 3 is a top view of the light-emitting diode package of FIG. 1;
FIG. 4 is a bottom view of the light-emitting diode package of FIG. 1;
FIG. 5 is an end view of the light-emitting diode package of FIG. 1;
FIG. 6 is an opposing end view of the light-emitting diode package of FIG. 1;
FIG. 7 is a side view of the light-emitting diode package of FIG. 1;
FIG. 8 is an opposing side view of the light-emitting diode package of FIG. 1;
FIG. 9 is a top perspective view of another embodiment of a light-emitting diode package;
FIG. 10 is a bottom perspective view of the light-emitting diode package of FIG. 9;
FIG. 11 is a top view of the light-emitting diode package of FIG. 9;
FIG. 12 is a bottom view of the light-emitting diode package of FIG. 9;
FIG. 13 is an end view of the light-emitting diode package of FIG. 9;
FIG. 14 is an opposing end view of the light-emitting diode package of FIG. 9;
FIG. 15 is a side view of the light-emitting diode package of FIG. 9; and,
FIG. 16 is an opposing side view of the light-emitting diode package of FIG. 9.
The dashed broken lines shown in the drawings depict portions of the light-emitting diode package that form no part of the claimed design.
The dot-dashed broken lines shown in the drawings depict portions of the light-emitting diode package that represent boundaries of the claimed design and are not part of the claimed design.

公开(公告)号：US20240072212A1

公开(公告)日：2024-02-29

申请号：US17821881

申请日：2022-08-24

Applicant: CreeLED, Inc.

Inventor： Tucker McFarlane ,  Robert Wilcox ,  David Suich ,  Thomas Celano ,  Michael Check ,  Colin Blakely

IPC: H01L33/48 ,  H01L33/54 ,  H01L33/58

CPC classification number: H01L33/483 ,  H01L33/54 ,  H01L33/58 ,  H01L33/32

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly sealing structures for LED packages are disclosed. Sealing structures include multiple seals within an LED package that provide a multiple barrier structure for enhanced protection from elemental ingress from a surrounding environment. Certain seals may be provided as bonding materials between cover structures and submounts of LED packages, thereby enclosing LED chips. Additional seals may be provided as coatings on surfaces of LED chips and/or submounts that are between cover structures and LED chips. Sealing structures may include multiple levels of hermetic seals with LED packages.

公开(公告)号：US11876155B2

公开(公告)日：2024-01-16

申请号：US17496320

申请日：2021-10-07

Applicant: CreeLED, Inc.

Inventor： David Suich ,  Michael Check ,  Colin Blakely

IPC: H01L33/50 ,  H01L33/58 ,  H01L33/54 ,  F21V23/00 ,  H01L25/075 ,  F21Y113/13 ,  F21Y105/16 ,  F21Y115/10

CPC classification number: H01L33/504 ,  F21V23/005 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/58 ,  F21Y2105/16 ,  F21Y2113/13 ,  F21Y2115/10

Abstract: Light-emitting diode (LED) packages, and more particularly broad electromagnetic spectrum LED packages are disclosed. Individual LED packages are disclosed that are capable of emitting various combinations of peak wavelengths across a broad electromagnetic spectrum, including one or more combinations of ultraviolet, visible, and infrared peak wavelengths. Such LED packages may also be broadly tunable across portions of the electromagnetic spectrum ranging from ultraviolet to infrared wavelengths. By providing such capabilities within a single light source provided by a single LED package, larger and more complex systems for broadband emissions that include multiple light sources, complex optical systems, mirrors, filters, and additional components may be avoided. LED chip arrangements, control schemes, and encapsulant arrangements are also disclosed for such broad electromagnetic spectrum LED packages.

公开(公告)号：US20230361249A1

公开(公告)日：2023-11-09

申请号：US18308323

申请日：2023-04-27

Applicant: CreeLED, Inc.

Inventor： Michael Check ,  Michael John Bergmann ,  David Suich ,  Kevin Haberern

IPC: H01L33/38 ,  H01L33/20

CPC classification number: H01L33/385 ,  H01L33/20

Abstract: Light-emitting diode (LED) chips and, more particularly, structures of LED chips with electrically insulating substrates and related methods are disclosed. LED chips include at least one opening that extends through a substrate to provide an electrical pathway to an active LED structure. Another electrical connection may be provided on the active LED structure in a position that forms a vertical contact arrangement. The at least one opening may extend through the substrate and into a portion of the active LED structure to provide increased surface area for the electrical connection. Additional LED chip structures include another opening on the active LED structure that is registered with the opening in the substrate, and electrical connections to a same layer of the active LED structure may be provided within each opening. Related methods include laser drilling the at least one opening in the substrate.

公开(公告)号：US11335833B2

公开(公告)日：2022-05-17

申请号：US16118779

申请日：2018-08-31

Applicant: CreeLED, Inc.

Inventor： Sung Chul Joo ,  Kenneth M. Davis ,  David Suich ,  Jae-Hyung Park ,  Arthur F. Pun

IPC: H01L33/10 ,  H01L33/50 ,  H01L33/62 ,  H01L33/36 ,  H01L25/075

Abstract: Light-emitting diodes (LEDs), LED arrays, and related devices are disclosed. An LED device includes a first LED chip and a second LED chip mounted on a submount with a light-altering material in between. The light-altering material may include at least one of a light-reflective material and/or a light-absorbing material. Individual wavelength conversion elements may be arranged on each of the first and second LED chips. The light-altering material may improve the contrast between the first and second LED chips as well as between the individual wavelength conversion elements. LED devices may include submounts in modular configurations where LED chips may be mounted on adjacent submounts to form an LED array. Each LED chip of the LED array may be laterally separated from at least one other LED chip by a same distance and a light-altering material may be arranged around the LED array.

公开(公告)号：US20250006712A1

公开(公告)日：2025-01-02

申请号：US18345270

申请日：2023-06-30

Applicant: CreeLED, Inc.

Inventor： Andre Pertuit ,  Robert Wilcox ,  David Suich ,  Michael Check ,  Colin Blakely

IPC: H01L25/075 ,  H01L33/00

Abstract: Embodiments of a light-emitting diode (LED) device are disclosed. In some embodiments, the LED device includes a first LED device and one or more other LED devices mounted to the first LED device. By mounting the other LED devices to the first LED device, the LED devices are arranged in a stacked configuration. This allows for better light mixing of the light emitted by the various LED devices since the LED devices are at least partially aligned with one another. Different manners of stacking the LED devices are disclosed. The scope of the disclosure includes the specific embodiments disclosed as well as other combinations depending on the color mixing profile that is desired.

公开(公告)号：US20240266478A1

公开(公告)日：2024-08-08

申请号：US18163396

申请日：2023-02-02

Applicant: CreeLED, Inc.

Inventor： Andre Pertuit ,  Michael Check ,  David Suich ,  Colin Blakely ,  Robert Wilcox

IPC: H01L33/50 ,  H01L33/60

CPC classification number: H01L33/504 ,  H01L33/60 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly lumiphoric particle structures in wavelength conversion elements for LEDs and related methods are disclosed. Lumiphoric particle structures include coatings that provide improved optical, mechanical, and/or thermal characteristics when distributed within host materials of wavelength conversion elements. Coatings are pre-formed on lumiphoric particles before the lumiphoric particles are integrated with wavelength conversion elements. Heat treatments associated with firing wavelength conversion elements may diffuse coating materials within wavelength conversion elements to form graded material structures for further improvements to optical, mechanical, and/or thermal characteristics.

公开(公告)号：US20240162381A1

公开(公告)日：2024-05-16

申请号：US17984875

申请日：2022-11-10

Applicant: CreeLED, Inc.

Inventor： David Suich ,  Robert Wilcox ,  Michael Check ,  Andre Pertuit ,  Colin Blakely

IPC: H01L33/20 ,  H01L33/00 ,  H01L33/50

CPC classification number: H01L33/20 ,  H01L33/005 ,  H01L33/502 ,  H01L2933/0041

Abstract: The present disclosure relates to techniques for providing and fabricating a 3D shaped cover structure for a light emitting diode (LED) package that has improved light emission efficiencies and color over angle emissions over flat cover structures. The cover structure can form a hemispherical dome over an LED chip, so that light incident on the inside surface of the dome will be at a more acute angle which can reduce the internal reflection of light emitted by the LED chip. The cover structure can also serve as a remote phosphor lumiphore, thereby improving color over angle emission and reduce the need for an additional adhesion interface on the LED. The cover structure can be shaped during a green sheet lamination and sintering process to create the 3D shape. In other embodiments, a structure can be machined into a desired shape.