公开(公告)号：US20190289714A1

公开(公告)日：2019-09-19

申请号：US16433988

申请日：2019-06-06

Applicant: DELL PRODUCTS, L.P.

Inventor： VIJENDERA KUMAR ,  BHYRAV M. MUTNURY ,  V. MALLIKARJUN GOUD

IPC: H05K1/11 ,  H05K1/02 ,  H01R12/72

Abstract: A method includes attaching an adjacent pair of differential contact strips to a nonconductive surface of respective landing pads of a surface mount technology (SMT) pad structure of a circuit board substrate, the pair of differential contact strips having converging narrowing at a respective distal end and each having a proximal signal trace for conducting a high-speed communication signal to another functional component attached to a circuit board substrate. The method includes attaching a return current strip that is longitudinally aligned adjacent to the pair of differential contact strips on a first lateral side and connected to a ground plane of the circuit board substrate, the converging narrowing of the adjacent differential contact strip increasing separation from a distal end of the return current strip, the separation improving signal integrity by reducing fringe effects, increasing impedance, and quenching resonance.

公开(公告)号：US20180368259A1

公开(公告)日：2018-12-20

申请号：US15626244

申请日：2017-06-19

Applicant: DELL PRODUCTS, L.P.

Inventor： VIJENDERA KUMAR ,  BHYRAV M. MUTNURY ,  V. MALLIKARJUN GOUD

IPC: H05K1/11 ,  H01R12/72

CPC classification number: H05K1/111 ,  H01R12/72 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/025 ,  H05K2201/0792 ,  H05K2201/09154 ,  H05K2201/09381

Abstract: An Information handling system (IHS) includes a circuit board assembly with surface mount technology (SMT) pad structure. Landing pad(s) attached to circuit board substrate have a mounting area that receive an SMT connector pin onto adjacent pair of differential contact strips plated to nonconductive surface and extending longitudinally in parallel alignment. A return current strip is longitudinally aligned, adjacent to the differential contact strips on a first lateral side. The return current strip is connected to a ground plane of the circuit board substrate. Converging narrowing of the adjacent differential contact strip increases separation from a distal end of the return current strip. The separation improves signal integrity by reducing fringe effects, increasing impedance, and quenching resonance. A surface mount device (SMD) has one or more connector pins that are attached to the one or more landing pads to conduct the high-speed communication signal.