公开(公告)号：US11731220B2

公开(公告)日：2023-08-22

申请号：US17243480

申请日：2021-04-28

Applicant: Delta Electronics, Inc.

Inventor： Shih-Lin Huang ,  Sien Wu ,  Baoxun He ,  Ti-Jun Wang

IPC: B23P15/26 ,  F28D15/04 ,  F28D15/02 ,  B23K26/21 ,  B23K101/14 ,  F28F19/00 ,  F28F21/08

CPC classification number: B23P15/26 ,  B23K26/21 ,  F28D15/0233 ,  F28D15/04 ,  B23K2101/14 ,  B23P2700/09 ,  F28F19/00 ,  F28F21/083 ,  F28F21/085 ,  F28F21/086 ,  F28F2225/04 ,  F28F2275/067

Abstract: A vapor chamber with a support structure and its manufacturing method are provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.

公开(公告)号：US10145619B2

公开(公告)日：2018-12-04

申请号：US15783300

申请日：2017-10-13

Applicant: DELTA ELECTRONICS, INC.

Inventor： Shih-Lin Huang ,  Chiu-Kung Chen ,  Sien Wu ,  Ti-Jun Wang

IPC: F28D15/02

Abstract: A heat pipe is disclosed in the present invention. The heat pipe includes a first pipe and at least a second pipe. The first pipe is formed with an enclosed space. The second pipe is disposed in the enclosed space. There is no wick structure disposed between the first pipe and the second pipe.