公开(公告)号：US20220415843A1

公开(公告)日：2022-12-29

申请号：US17842086

申请日：2022-06-16

Applicant: DENSO CORPORATION

Inventor： Hideki KAWAHARA

IPC: H01L23/00

Abstract: A semiconductor device includes a semiconductor element, a conductive member, and solder portions. The semiconductor element includes first main electrodes and a protective film on a first main surface, and a second main electrode on a second main surface. The protective film has an interposed film portion between the first main electrodes. The conductive member has facing portions each facing a corresponding one of the first main electrodes and an interposed conductive portion disposed between the facing portions. The solder portions are disposed between the first main electrodes and the facing portions and separated away from each other by the interposed film portion and the interposed conductive portion to define a space between the solder portions. The interposed film portion and the interposed conductive portion are less likely wetted to the solder portions to avoid the solder portions in liquid phase entering into the space during soldering.

公开(公告)号：US20140346635A1

公开(公告)日：2014-11-27

申请号：US14267513

申请日：2014-05-01

Applicant: DENSO CORPORATION

Inventor： Hideki KAWAHARA ,  Takanori IMAZAWA

IPC: H01L27/06

CPC classification number: H01L23/49562 ,  H01L23/495 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/371 ,  H01L2224/37599 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/12035 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H03K17/04 ,  H03K19/01 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor module includes: a semiconductor element; first and second main current passages for energizing the semiconductor element, the first and second main current passages being opposed to each other in such a manner that a first energization direction of the first main current passage is opposite to a second energization direction of the second main current passage, or an angle between the first energization direction and the second energization direction is an obtuse angle; and a coil unit sandwiched between the first and second main current passages. The coil unit includes a coil, which generates an induced electromotive force when a magnetic flux interlinks with the coil, the magnetic flux being generated when current flows through the first and second main current passages.

Abstract translation: 半导体模块包括：半导体元件; 用于激励半导体元件的第一和第二主电流通道，第一和第二主电流通道彼此相对，使得第一主电流通道的第一通电方向与第二主电流通道的第二通电方向相反 或者第一通电方向与第二通电方向之间的角度为钝角; 以及夹在第一和第二主电流通道之间的线圈单元。 线圈单元包括线圈，该线圈当磁通量与线圈相互连接时产生感应电动势，当电流流过第一和第二主电流通道时产生磁通量。

公开(公告)号：US20190088568A1

公开(公告)日：2019-03-21

申请号：US16088093

申请日：2017-04-27

Applicant: DENSO CORPORATION

Inventor： Hiroshi ISHINO ,  Hideki KAWAHARA ,  Shinji HIRAMITSU ,  Shunsuke ARAI

IPC: H01L23/36 ,  H01L25/07 ,  H02M7/48 ,  H01L23/00

Abstract: In a semiconductor device, a plurality of semiconductor chips included in an upper-arm circuit are connected in parallel between a pair of upper-arm plates, while a plurality of semiconductor chips included in a lower-arm circuit are connected in parallel between a pair of lower-arm plates. In each of the arm circuits, the plurality of semiconductor chips are arranged in a direction perpendicular to a direction in which emitter electrodes and pads are arranged, the pads are disposed on the same side of the emitter electrodes, and signal terminals extend in the same direction. A series-connecting part between the upper- and lower-arm circuits includes a joint part 20 continued to respective side surfaces of the corresponding upper- and lower-arm plates. Each of inductances of respective parallel-connecting parts of the upper- and lower-arm plates which connect the semiconductor chips in parallel is smaller than an inductance of the series-connecting part.