公开(公告)号：US20220223544A1

公开(公告)日：2022-07-14

申请号：US17708525

申请日：2022-03-30

Applicant: DENSO CORPORATION

Inventor： Daisuke FUKUOKA ,  Tomomi OKUMURA ,  Yuuji OOTANI ,  Wataru KOBAYASHI ,  Takumi NOMURA ,  Tomoaki MITSUNAGA ,  Takahiro HIRANO ,  Takamichi SAKAI ,  Kengo OKA

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48

Abstract: In a semiconductor device, a semiconductor element has a front electrode and a back electrode. The back electrode is connected to a wiring member through a bonding member. Wire pieces are disposed in the bonding member, and bonded to a bonding surface of the wiring member to protrude toward the semiconductor element. The bonding member has, in a plan view, a central region that overlaps with a central portion of the semiconductor element including an element center, and an outer peripheral region that includes a portion overlapping with an outer peripheral portion of the semiconductor element surrounding the central portion and surrounds the central region. At least four wire pieces are disposed in the outer peripheral region at positions corresponding to at least four respective corners of the semiconductor element. At least one wire piece is disposed to extend toward the element center in the plan view.