公开(公告)号：US20200328132A1

公开(公告)日：2020-10-15

申请号：US16914903

申请日：2020-06-29

Applicant: DENSO CORPORATION

Inventor： Wataru KOBAYASHI ,  Kazuki KODA

IPC: H01L23/31 ,  H01L23/495 ,  H01L23/00 ,  H01L21/48 ,  B23K26/354 ,  B29C65/00 ,  H01L23/50 ,  B23K26/00

Abstract: An electronic device includes: a support member that has a metallic placement surface joined to the conductive bonding layer, and a metallic sealing surface provided on an outer side of the placement surface in an in-plane direction of the placement surface to adjoin the placement surface and to surround the placement surface; and a resin member, which is a synthetic resin molded article, joined to the sealing surface and covering the electronic component. The sealing surface includes a rough surface having a plurality of laser irradiation marks having a substantially circular shape. The rough surface includes a first region and a second region. The second region has a higher density of the laser irradiation marks in the in-plane direction than the first region.

公开(公告)号：US20200306888A1

公开(公告)日：2020-10-01

申请号：US16902310

申请日：2020-06-16

Applicant: DENSO CORPORATION

Inventor： Wataru KOBAYASHI ,  Takumi NOMURA ,  Yukinori YAMASHITA

IPC: B23K26/352 ,  B23K26/00 ,  B23K26/0622 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

Abstract: An electronic device includes a support member and a mount member mounting on the support member. The support member and the mount member are sealed by a resin member. The support member includes a surface having a laser irradiation mark. The mount member includes a surface having a rough portion with an accumulation of material of the support member.

公开(公告)号：US20200043835A1

公开(公告)日：2020-02-06

申请号：US16596897

申请日：2019-10-09

Applicant: DENSO CORPORATION

Inventor： Takumi NOMURA ,  Wataru KOBAYASHI ,  Kazuki KODA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L23/29 ,  H01L21/48 ,  H01L21/56

Abstract: A base material includes one surface, and a side surface continuous with the one surface. Each of the one surface and the side surface has a sealed region to be sealed with mold resin. The one surface has a one surface rough region in the sealed region thereof. The side surface has a side surface rough region in the sealed region thereof.

公开(公告)号：US20220223544A1

公开(公告)日：2022-07-14

申请号：US17708525

申请日：2022-03-30

Applicant: DENSO CORPORATION

Inventor： Daisuke FUKUOKA ,  Tomomi OKUMURA ,  Yuuji OOTANI ,  Wataru KOBAYASHI ,  Takumi NOMURA ,  Tomoaki MITSUNAGA ,  Takahiro HIRANO ,  Takamichi SAKAI ,  Kengo OKA

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48

Abstract: In a semiconductor device, a semiconductor element has a front electrode and a back electrode. The back electrode is connected to a wiring member through a bonding member. Wire pieces are disposed in the bonding member, and bonded to a bonding surface of the wiring member to protrude toward the semiconductor element. The bonding member has, in a plan view, a central region that overlaps with a central portion of the semiconductor element including an element center, and an outer peripheral region that includes a portion overlapping with an outer peripheral portion of the semiconductor element surrounding the central portion and surrounds the central region. At least four wire pieces are disposed in the outer peripheral region at positions corresponding to at least four respective corners of the semiconductor element. At least one wire piece is disposed to extend toward the element center in the plan view.

公开(公告)号：US20160207148A1

公开(公告)日：2016-07-21

申请号：US14914061

申请日：2014-11-10

Applicant: DENSO CORPORATION

Inventor： Wataru KOBAYASHI ,  Eiji HAYASHI ,  Kazuki KOUDA

IPC: B23K26/359 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  B23K26/00 ,  H01L21/48

CPC classification number: B23K26/359 ,  B23K26/00 ,  B23K26/0006 ,  B23K26/0626 ,  B23K26/354 ,  B23K26/355 ,  B23K26/3584 ,  B23K2101/40 ,  B23K2103/08 ,  H01L21/4821 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/32 ,  H01L2224/291 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/83464 ,  H01L2924/40102 ,  H01L2924/014 ,  H01L2924/00014

Abstract: An object is to form a rough surface for ensuring adhesion between a metal member and other members, or a rough surface for suppressing solder expansion in the metal member using an energy beam having energy density lower than a related art. A surface processing method of a metal member, in which a metal thin film is arranged on a surface of a base, includes: melting or evaporating a surface portion of the metal thin film by irradiating the metal thin film with a pulse-oscillated laser beam having energy density of 100 J/cm2 or less and a pulse width of 1 μs or less; and roughening the surface of the metal thin film by solidifying the surface portion of the metal thin film after the melting or evaporating. The metal thin film is made of at least one of Ni, Au, Pd, and Ag as a main component.

Abstract translation: 目的是形成用于确保金属构件与其它构件之间的粘合的粗糙表面，或者使用能量密度低于现有技术的能量束来抑制金属构件中的焊料膨胀的粗糙表面。 金属构件的表面处理方法，其中金属薄膜布置在基体的表面上，包括：通过用脉冲振荡的激光束照射金属薄膜来熔化或蒸发金属薄膜的表面部分 能量密度为100J / cm 2以下，脉冲宽度为1μs以下; 并且通过在熔化或蒸发之后固化金属薄膜的表面部分来使金属薄膜的表面变粗糙。 金属薄膜由Ni，Au，Pd和Ag中的至少一种作为主要成分。

公开(公告)号：US20210090967A1

公开(公告)日：2021-03-25

申请号：US17116269

申请日：2020-12-09

Applicant: DENSO CORPORATION

Inventor： Wataru KOBAYASHI ,  Kazuki KODA

IPC: H01L23/31 ,  H01L23/495 ,  H01L23/00 ,  H01L21/48 ,  B23K26/354 ,  B29C65/00 ,  H01L23/50 ,  B23K26/00

Abstract: An electronic device includes: a support member that has a metallic placement surface joined to the conductive bonding layer, and a metallic sealing surface provided on an outer side of the placement surface in an in-plane direction of the placement surface to adjoin the placement surface and to surround the placement surface; and a resin member, which is a synthetic resin molded article, joined to the sealing surface and covering the electronic component. The sealing surface includes a rough surface having a plurality of laser irradiation marks having a substantially circular shape. The rough surface includes a first region and a second region. The second region has a higher density of the laser irradiation marks in the in-plane direction than the first region.

公开(公告)号：US20170144882A1

公开(公告)日：2017-05-25

申请号：US15300363

申请日：2015-04-17

Applicant: DENSO CORPORATION

Inventor： Nobukazu OBA ,  Yasuhiro YAMASHITA ,  Wataru KOBAYASHI ,  Eiji HAYASHI

IPC: B81B7/00 ,  G01L23/24 ,  G01L9/00

CPC classification number: B81B7/0058 ,  B81B2201/0264 ,  G01L9/00 ,  G01L9/0054 ,  G01L23/24 ,  H01L23/24 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device includes: a semiconductor element; a case; a terminal made of a conductive material and embedded in the case, a part of the terminal being exposed to the outside, having an outermost surface that includes a first film, and having a base portion; a bonding wire that is connected to the first film and electrically connects the semiconductor element and the terminal; and a protection member that is more flexible than the case and covers a contact portion of the terminal contacting with the bonding wire. The first film is removed from an area around the contact portion with the bonding wire in the part of the terminal being exposed to the outside, causing the base portion to be exposed. An exposed portion of the base portion and the protection member adhere to each other.

公开(公告)号：US20190237378A1

公开(公告)日：2019-08-01

申请号：US16382323

申请日：2019-04-12

Applicant: DENSO CORPORATION

Inventor： Wataru KOBAYASHI ,  Kazuki KODA

IPC: H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/3142 ,  B23K26/00 ,  B23K26/354 ,  B29C65/00 ,  H01L21/4821 ,  H01L23/28 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/50 ,  H01L24/32 ,  H01L2224/27013 ,  H01L2224/32245

Abstract: An electronic device includes: a support member that has a metallic placement surface joined to the conductive bonding layer, and a metallic sealing surface provided on an outer side of the placement surface in an in-plane direction of the placement surface to adjoin the placement surface and to surround the placement surface; and a resin member, which is a synthetic resin molded article, joined to the sealing surface and covering the electronic component. The sealing surface includes a rough surface having a plurality of laser irradiation marks having a substantially circular shape. The rough surface includes a first region and a second region. The second region has a higher density of the laser irradiation marks in the in-plane direction than the first region.

公开(公告)号：US20190206761A1

公开(公告)日：2019-07-04

申请号：US16296868

申请日：2019-03-08

Applicant: DENSO CORPORATION

Inventor： Takumi NOMURA ,  Wataru KOBAYASHI ,  Kazuki KODA

IPC: H01L23/367 ,  H01L23/13 ,  H01L21/48 ,  H01L23/29 ,  H01L23/31 ,  H01L23/373 ,  H01L21/56 ,  H05K7/20 ,  B23K26/354 ,  F28F3/02 ,  B29C65/70

Abstract: A metal member includes a metal substrate and a porous metal layer. A composite includes the metal member and a resin member. The metal substrate has one surface, is made of a metal material, and has a region formed as an uneven layer having an uneven shape with respect to the one surface. The porous metal layer has a mesh-like shape and is formed on the uneven layer. The uneven layer includes a plurality of protrusions protruding in a direction normal to the one surface.

公开(公告)号：US20170278774A1

公开(公告)日：2017-09-28

申请号：US15508506

申请日：2015-12-04

Applicant: DENSO CORPORATION

Inventor： Eiji HAYASHI ,  Wataru KOBAYASHI ,  Eiji NOMURA ,  Kazuki KOUDA

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/00 ,  H01L21/56 ,  H01L25/065 ,  H01L23/29 ,  H01L21/48

CPC classification number: H01L23/4952 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/4334 ,  H01L23/488 ,  H01L23/49527 ,  H01L23/49562 ,  H01L23/49575 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/33 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A semiconductor device includes: a semiconductor chip having an electrode on one surface; a first conductive member disposed on one surface side of the semiconductor chip; a metal member having a base member and a membrane and disposed between the semiconductor chip and the first conductive member; a first solder disposed between the electrode of the semiconductor chip and the metal member; and a second solder disposed between the metal member and the first conductive member. The membrane has a metal thin film arranged on the surface of the base member and an uneven oxide film. The uneven oxide film is arranged on the metal thin film in at least a part of a connection region of a surface of the metal member, the connection region connecting a first connection region to which the first solder is connected and a second connection region to which the second solder is connected.