公开(公告)号：US20200043835A1

公开(公告)日：2020-02-06

申请号：US16596897

申请日：2019-10-09

Applicant: DENSO CORPORATION

Inventor： Takumi NOMURA ,  Wataru KOBAYASHI ,  Kazuki KODA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L23/29 ,  H01L21/48 ,  H01L21/56

Abstract: A base material includes one surface, and a side surface continuous with the one surface. Each of the one surface and the side surface has a sealed region to be sealed with mold resin. The one surface has a one surface rough region in the sealed region thereof. The side surface has a side surface rough region in the sealed region thereof.

公开(公告)号：US20200306888A1

公开(公告)日：2020-10-01

申请号：US16902310

申请日：2020-06-16

Applicant: DENSO CORPORATION

Inventor： Wataru KOBAYASHI ,  Takumi NOMURA ,  Yukinori YAMASHITA

IPC: B23K26/352 ,  B23K26/00 ,  B23K26/0622 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

Abstract: An electronic device includes a support member and a mount member mounting on the support member. The support member and the mount member are sealed by a resin member. The support member includes a surface having a laser irradiation mark. The mount member includes a surface having a rough portion with an accumulation of material of the support member.

公开(公告)号：US20220223544A1

公开(公告)日：2022-07-14

申请号：US17708525

申请日：2022-03-30

Applicant: DENSO CORPORATION

Inventor： Daisuke FUKUOKA ,  Tomomi OKUMURA ,  Yuuji OOTANI ,  Wataru KOBAYASHI ,  Takumi NOMURA ,  Tomoaki MITSUNAGA ,  Takahiro HIRANO ,  Takamichi SAKAI ,  Kengo OKA

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48

Abstract: In a semiconductor device, a semiconductor element has a front electrode and a back electrode. The back electrode is connected to a wiring member through a bonding member. Wire pieces are disposed in the bonding member, and bonded to a bonding surface of the wiring member to protrude toward the semiconductor element. The bonding member has, in a plan view, a central region that overlaps with a central portion of the semiconductor element including an element center, and an outer peripheral region that includes a portion overlapping with an outer peripheral portion of the semiconductor element surrounding the central portion and surrounds the central region. At least four wire pieces are disposed in the outer peripheral region at positions corresponding to at least four respective corners of the semiconductor element. At least one wire piece is disposed to extend toward the element center in the plan view.

公开(公告)号：US20190206761A1

公开(公告)日：2019-07-04

申请号：US16296868

申请日：2019-03-08

Applicant: DENSO CORPORATION

Inventor： Takumi NOMURA ,  Wataru KOBAYASHI ,  Kazuki KODA

IPC: H01L23/367 ,  H01L23/13 ,  H01L21/48 ,  H01L23/29 ,  H01L23/31 ,  H01L23/373 ,  H01L21/56 ,  H05K7/20 ,  B23K26/354 ,  F28F3/02 ,  B29C65/70

Abstract: A metal member includes a metal substrate and a porous metal layer. A composite includes the metal member and a resin member. The metal substrate has one surface, is made of a metal material, and has a region formed as an uneven layer having an uneven shape with respect to the one surface. The porous metal layer has a mesh-like shape and is formed on the uneven layer. The uneven layer includes a plurality of protrusions protruding in a direction normal to the one surface.