公开(公告)号：US20220017794A1

公开(公告)日：2022-01-20

申请号：US17418445

申请日：2019-08-23

Applicant: DOOSAN CORPORATION

Inventor： Taejin CHOI ,  Woojeong KIM

IPC: C09J11/04 ,  C09J163/00 ,  C09J11/06 ,  H01L23/00

Abstract: A non-conductive adhesive film for semiconductor packages and a method of manufacturing a semiconductor package using the non-conductive adhesive film are disclosed. The non-conductive adhesive film for semiconductor packages includes a base; and an adhesive layer disposed on one surface of the base and having a storage modulus in a range of 2 to 4 GPa at 25° C.

公开(公告)号：US20240186153A1

公开(公告)日：2024-06-06

申请号：US18438158

申请日：2024-02-09

Applicant: DOOSAN CORPORATION

Inventor： Taejin CHOI ,  Chunggu Lee ,  Sooin Park ,  Jungjin lee

IPC: H01L21/56 ,  C09J7/38 ,  C09J7/40 ,  C09J163/00 ,  H01L23/00

CPC classification number: H01L21/563 ,  C09J7/38 ,  C09J7/405 ,  C09J163/00 ,  H01L24/92 ,  C09J2203/326 ,  C09J2463/00 ,  C09J2467/005 ,  H01L2224/92125

Abstract: An underfill film for semiconductor packages and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film includes an adhesive layer in which a melt viscosity and an onset temperature are adjusted to a predetermined range such that production efficiency may be improved by simplifying packaging process of the semiconductor packages. Also the underfill film and the manufacturing process may improve connection reliability of the package.

公开(公告)号：US20220199430A1

公开(公告)日：2022-06-23

申请号：US17404009

申请日：2021-08-17

Applicant: DOOSAN CORPORATION

Inventor： Taejin CHOI ,  Chunggu LEE ,  Sooin PARK ,  Jungjin LEE

IPC: H01L21/56 ,  C09J7/40 ,  C09J163/00 ,  C09J7/38 ,  H01L23/00

Abstract: An underfill film for semiconductor packages and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film includes an adhesive layer in which a melt viscosity and an onset temperature are adjusted to a predetermined range such that production efficiency may be improved by simplifying packaging process of the semiconductor packages. Also the underfill film and the manufacturing process may improve connection reliability of the package.

公开(公告)号：US20230027838A1

公开(公告)日：2023-01-26

申请号：US17782452

申请日：2020-12-04

Applicant: DOOSAN CORPORATION

Inventor： Taejin CHOI ,  Sooin PARK

IPC: C09J7/35 ,  C09J5/06 ,  H01L23/00

Abstract: An underfill film for a semiconductor package and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film is suitable for a semiconductor package, which, by including an adhesive layer having low lowest melt viscosity, can improve the connection reliability of a package by minimizing the formation of voids during semiconductor packaging.