公开(公告)号：US10759152B2

公开(公告)日：2020-09-01

申请号：US16205687

申请日：2018-11-30

Applicant: Dow Global Technologies LLC

Inventor： Jeffrey E Bonekamp ,  Yushan Hu ,  Nichole E. Nickel ,  Lih-Long Chu ,  John A. Naumovitz ,  Mark G. Hofius

IPC: B32B27/32 ,  H01L31/049 ,  H01L31/048 ,  C08L53/00 ,  B32B27/08 ,  H01L31/18

Abstract: A multilayer film structure including a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B includes a crystalline block composite resin or a block composite resin and bottom Layer C includes a polyolefin having at least one melting point greater than 125 C.

公开(公告)号：US20190118517A1

公开(公告)日：2019-04-25

申请号：US16205687

申请日：2018-11-30

Applicant: Dow Global Technologies LLC

Inventor： Jeffrey E. Bonekamp ,  Yushan Hu ,  Nichole E. Nickel ,  Lih-Long Chu ,  John a. Naumovitz ,  Mark G. Hofius

IPC: B32B27/32 ,  B32B27/08 ,  H01L31/048 ,  H01L31/049

CPC classification number: B32B27/32 ,  B32B27/08 ,  B32B27/327 ,  B32B2250/242 ,  B32B2307/704 ,  B32B2457/12 ,  C08L53/00 ,  H01L31/0481 ,  H01L31/049 ,  H01L31/18 ,  Y02E10/50

Abstract: A multilayer film structure comprising a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B comprises a crystalline block composite resin or a block composite resin and bottom Layer C comprises a polyolefin having at least one melting point greater than 125° C.

公开(公告)号：US20140174509A1

公开(公告)日：2014-06-26

申请号：US14119588

申请日：2012-06-28

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： Jeffrey E. Bonekamp ,  Yushan Hu ,  Nichole E. Nickel ,  Lih-Long Chu ,  John A. Naumovitz ,  Mark G. Hofius

IPC: H01L31/048 ,  B32B27/08 ,  H01L31/18 ,  B32B27/32

CPC classification number: H01L31/049 ,  B29C41/003 ,  B29C41/26 ,  B29C41/32 ,  B29K2023/06 ,  B29K2023/0625 ,  B29L2009/00 ,  B32B27/08 ,  B32B27/32 ,  B32B37/185 ,  B32B2270/00 ,  B32B2323/04 ,  B32B2457/12 ,  C08L53/00 ,  C08L2203/204 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2205/035 ,  C08L2205/12 ,  H01L31/0481 ,  H01L31/18 ,  Y02E10/50

Abstract: Disclosed are multilayer film structures comprising a layer (B) that comprises a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), comprising i) an ethylene polymer (EP) comprising at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer comprising (a) an ethylene polymer block comprising at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that comprises a polyolefin having at least one melting peak greater than 1255 C, the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably comprises (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules comprising an electronic device such as a PV cell. Also disclosed is a lamination process to construct a laminated PV module comprising such multilayer film structures.

Abstract translation: 公开了包括包含结晶嵌段共聚物复合物（CBC）或特定嵌段共聚物复合材料（BC）的层（B）的多层膜结构，其包含i）包含至少80mol％聚合的乙烯的乙烯聚合物（EP） ii）基于α-烯烃的结晶聚合物（CAOP）和iii）包含（a）包含至少80mol％聚合的乙烯和（b）结晶α-烯烃嵌段（CAOB））的乙烯聚合物嵌段的嵌段共聚物; 以及包含聚烯烃的层C，其具有大于1255℃的至少一个熔融峰，层C的上表面与层B的底面表面粘合接触。这种多层膜结构优选包含（A）密封层 A具有与层B的顶面表面粘合接触的底部面部表面。这种膜适用于包括诸如PV电池的电子器件的电子器件（ED）模块。 还公开了构成包含这种多层膜结构的叠层PV模块的叠层工艺。